Infineon Technologies AG has expanded its Bluetooth portfolio by eight new products in the AIROC CYW20829 Bluetooth Low Energy 5.4 microcontroller (MCU) family, featuring systems-on-chip (SoCs) and modules optimized for industrial, consumer and automotive use cases. The high integration of the CYW20829 product family allows designers to reduce bill-of-material (BOM) cost and device footprint in a wide variety of applications, including PC accessories, low-energy audio, wearables, solar micro inverters, asset trackers, health and lifestyle, home automation and others. Product designers also benefit from Infineon’s rich development infrastructure and commitment to robust security, with support for secure boot and execution environments and cryptography acceleration to safeguard sensitive data.
The latest automotive part in the product family, the AIROC CYW89829 Bluetooth Low-Energy MCU, is ideal for car access and wireless battery management systems (wBMS) applications, due to its robust radio frequency (RF) performance, long range and latest Bluetooth 5.4 features including PAwR (Periodic
Source: Infineon Technologies AG Advertising with Responses). The dual ARM Cortex core design of the chip family features separate application and Bluetooth Low Energy subsystems that deliver full featured support for Bluetooth 5.4, low-power, 10 dBm output power without a PA, integrated flash, CAN FD, crypto accelerators, high security including Root of Trust (RoT), and is PSA level 1 ready.
Availability
The new products are available in a range of variants, each with its specific characteristics and focus applications.
Products currently in production are:
- CYW20829B0000, in a 56QFN SoC package, 6 mm x 6 mm, designed for PC accessories, remotes, ESL and low-end BLE MCUs
- CYW20829B0010, packaged in 56QFN SoC with a dimension of 6 mm x 6 mm, suitable for gaming accessories and LE Audio products
- CYW20829B0-P4EPI100 and CYW20829B0-P4TAI100 modules, both with a dimension of 14.5 mm x 19 mm, suitable for long-range, asset tracking, power tools and generic Bluetooth LE use cases
Sampling now are:
- CYW20829B0021, in a 40QFN SoC package, 6 mm x 6 mm, suited for industrial and long-range applications
- CYW89829B0022, in a 40QFN SoC package 6 mm x 6 mm, designed for wireless BMS and car access
- CYW89829B0232, in a 77BGA SoC package, 7 mm x 8 mm, suitable for wireless BMS and car access
- In the second quarter of 2025, samples are expected of the CYW20829B1230, which will be available in a 64 Ball BGA SoC package with a dimension of 4.5 mm x 4.5 mm and suitable for wearables, power tools and asset tracking
