Mobile Devices

MWC 2024: SolidRun unveils first AMD Ryzen-based com module

28 February 2024
The AMD Ryzen Com Express module for networking and communication applications. Source: SolidRun

At this week’s Mobile World Congress 2024, SolidRun introduced its first x86-based communications module built on the 8-core/16-thread AMD Ryzen V3C48 processor.

Designed for a range of networking and edge applications, the module expands SolidRun’s CX7 product line to bring processing power, thermal efficiency and high-speed I/O connectivity to the Com Express Type 7 form factor.

The Ryzen-based com module features:

  • 20 lanes of PCIe Gen4
  • 10 Gb Ethernet MAC
  • 96 GB of dual-channel 64-bit DDR5 memory
  • Power efficiency range of 10 W to 54 W
  • Compact COM Express Type 7 form factor

SolidRun said the module could be used in enterprise and industrial applications like networking equipment, industrial automation and control, 5G infrastructure, AI-driven analytics and other server applications.

“AMD Ryzen Embedded V3000 processors meet the processing requirements of a wide range of embedded applications, including storage, cloud, enterprise, networking, security, and edge,” said Sasha Strizhiver, embedded product line manager at SolidRun. “With features such as extensive RAS coverage, enterprise-class reliability, and up to 10-year planned product availability, our new Ryzen V3000 CX7 SOM offers a compelling solution for industrial customers with demanding workloads.”

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