Semiconductor Equipment

GlobalFoundries enhances two transportation technologies

31 August 2023

Pure play foundry GlobalFoundries has enhanced two of its technology platforms to support the growing demand for autonomous, connected and electrified vehicles.

The 40ESF3 AutoPro175 technology is designed to work with GF’s existing AutoPro platform, a set of manufacturing services that minimize certification and accelerate time-to-market. The technology is suited for extreme temperature functions of a vehicle with a junction temperature of 175° C.

The second GF portfolio being enhanced is its power management solutions with its 130BCDLite Gen2 ATV125. Part of the BCD/BCDLite platforms, the technology enables die shrink and higher conversion efficiency for products that require up to 40 V while meeting the Auto Grade 1 qualification for multiple automotive applications.

GF said more than 30 users are currently using the BCD/BCDLite platform to develop integration of diverse functionality with power devices across a range of voltages.

The demand for semiconductors inside vehicles is soaring as the industry switches from mechanical to electronic systems, GF said. A vehicle uses about 1,000 semiconductors with some EVs containing over 3,000. As consumer demand for EVs increases, chip counts are only expected to increase.

“The shift from internal combustion engines (ICE) to autonomous, connected, and electrified (ACE) requires vehicle re-architecture,” said Mike Hogan, chief business unit offers at GF. “GF is perfectly positioned for this shift, and our recent technology advances support increased safety, enhanced user experience, and sustainability through vehicle electrification.”

To contact the author of this article, email GlobalSpecEditors@globalspec.com


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