Pure-play foundry GlobalFoundries and mixed-signal chipmaker Cirrus Logic are collaborating to accelerate the commercialization of next-generation bipolar-CMOS-DMOS (BCD) process technology — a semiconductor process used for smartphones, vehicles and more.
The collaboration will seek to develop BCD technology that is compact and powerful for the needs of consumers in the future. The technology will be manufactured in GF’s Malta, New York, fab.
GF currently has BCD manufacturing in its Singapore and Germany facilities. The Cirrus Logic collaboration will help to diversify the global supply chain and add domestic lines to the U.S. semiconductor manufacturing sector.
GaN collab
Additionally, the two companies will also develop gallium nitride (GaN) technology using GF’s Essex Junction, Vermont, fab’s process technology. GF’s GaN-on-silicon platform will be used to build semiconductors for consumer and industrial applications.
The move comes after the leading chipmaker in the world and leading foundry, Taiwan Semiconductor Manufacturing Co. (TSMC), said it would exit the GaN market by as soon as 2027. Experts believe TSMC is exiting the business due to increased price pressures from Chinese GaN makers and that GaN is not a major moneymaker for the foundry.
GF was named as one of the companies that may be able to take advantage of TSMC’s GaN exit as it already has processes in place at its facilities.
The joint GaN project will expand Cirrus Logic’s mixed-signal and power chip portfolio and offer new growth opportunities in the GaN market.
