Computer Electronics

E-con systems introduces time-of-flight camera for measuring 3D depth in machine vision applications

05 May 2023

California-based E-con Systems Inc. has introduced the DepthVista_MIPI_IRD 3D time-of-flight camera for precise 3D depth measurement.

According to the company, DepthVista_MIPI_IRD comes with a wide spectral range to power outdoor as well as indoor embedded machine vision systems. The camera uses the MIPI CSI 2 interface to connect to NVIDIA Jetson AGX Orin/AGX Xavier and it reportedly has a depth range to 12 m.

Source: E-con Systems, Inc.Source: E-con Systems, Inc.

Key features of the DepthVista_MIPI_IRD include 940 nm and 850 nm 3D imaging in outdoor and indoor lighting; multicamera without interference using a proprietary technique to operate multiple time-of-flight cameras without interference noise; compatibility with NVIDIA Jetson processor; and on-camera depth processing that avoids complications like running depth matching algorithms on the host platform.

For more information, visit the e-Con Systems website.

To contact the author of this article, email GlobalSpecEditors@globalspec.com


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