Industrial Electronics

Teledyne LeCroy adds support for USB4 version 2.0 physical layer testing

01 November 2022

Teledyne LeCroy has announced support for USB4 Version 2.0 physical layer compliance and validation with updates to its QualiPHY compliance test software and SDAIII-CompleteLinQ Serial Data Analysis software to support testing of new USB 80 Gbps data transfer speeds over the USB Type-C cable and connector.

User demand for higher performance displays, docks, hubs and storage, and a desire to maintain compatibility to the widely adopted USB Type-C connector, has led the USB Promoter Group to introduce USB4 Version 2.0, which doubles the existing USB4 data rate from USB 40 Gbps to USB 80 Gbps by using three-level pulse amplitude modulation (PAM3). The faster data transfer speeds add complexity to theSource: Teledyne LeCroySource: Teledyne LeCroy testing required to ensure interoperability between USB hosts and devices.

To meet developers’ needs for testing to this new version of USB, Teledyne LeCroy has added support for the increased data rates and new USB4 Version 2.0 test requirements to its QPHY-USB4-Tx-Rx physical layer compliance test software. Additionally, Teledyne LeCroy has added USB4 Version 2.0 PAM3 jitter and eye diagram analysis capabilities as an option to its widely used SDAIII-CompleteLinQ serial data jitter, eye diagram, noise and crosstalk analysis software. “We are pleased to see the ongoing support from Teledyne LeCroy for the physical layer updates to the USB4 Version 2.0 specification,” said Jeff Ravencraft, USB Implementers Forum (USB-IF) president and COO.

Teledyne LeCroy will preview the new capabilities at USB Developer Days Seattle 2022 on November 1 and 2 at the Grand Hyatt Seattle, Washington. This event will also be the first time that in-depth technical sessions will cover the USB4 Version 2.0 specification updates enabling USB4 80 Gbps data performance.

To contact the author of this article, email engineering360editors@globalspec.com


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