MEMS and Sensors

STM’s intelligent sensor combines a DSP and MEMS

24 February 2022
The ISPU packs a DSP with MEMS to allow smart sensors to place decision making in the application edge. Source: STM

ST Microelectronics (STM) has unveiled an intelligent sensor processing unit (ISPU) that combines a digital signal processor (DSP) to run artificial intelligence (AI) algorithms and microelectromechanical systems (MEMS) sensors on the same piece of silicon.

STM said the device reduces the size of system-in-package devices and cuts power by up to 80%. Additionally, by merging the sensor and the AI, it puts the electronic decision-making in the application edge. Products, enabled by smart sensors, can sense, process and take action to online devices and applications.

ISPU helps to migrate intelligent processing into sensors at the edge to give continuous assistance to connected technologies with seamless transitions between online and offline, the company said.

The DSP can be programmed in C and allows quantized AI sensors to support full- to single-bit precision neural networks. This allows for greater accuracy and efficiency in tasks such as activity recognition and anomaly detection by analyzing inertial data.

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