Ultra-rugged COM Express Type 6 Compact with soldered RAM

congatec introduces the 11th Gen Intel® Core® processor based Computer-on-Module, conga-TC570r, with soldered RAM for highest shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40–85° C, the new COM Express Type 6 Compact module provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications. For more price sensitive applications, congatec also offers a cost optimized Intel® Celeron® processor based variant for the extended temperature range from 0–60°C.

Typical customers for the new range of Computer-on-Modules based on the Tiger Lake microarchitecture are OEMs of trains, commercial vehicles, construction machines, agricultural vehicles, self-driving robots and many other mobile applications in the most challenging outdoor and off-road environments. Shock and vibration resistant stationary devices are another important application area as digitization requires critical infrastructure protection (CIP) against earthquakes and other mission critical events. All these applications can now benefit from super-fast LPDDR4X RAM with up to 4266 MT/s and in-band error-correcting code (IBECC) for single failure tolerance and high data transmission quality in EMI critical environments.