The rapidly growing power modules segment is characterized by high-growth applications ranging from electric vehicles (EVs), high-speed rail and a variety of industrial uses. A performance problem is posed by the stack of interconnects in power modules, which are a source of mechanical failures. Removal of heat between the direct bonded copper and baseplate is often the main source of thermal mismatches, making voids in this joint the most pressing challenge for power module manufacturers.
Source: Palomar Technologies
Join Palomar Technologies/SST Vacuum Reflow System at the Charged Magazine EV Engineering Conference on April 21, 2021, to learn more. SST Vacuum Reflow Systems' Alex Voronel will present "Power Modules: Typical failure modes and how to solve them" at 11:15 am PST/2:15 pm EST.
The virtual presentation will guide participants through the challenges facing the insulated-gate bipolar transistor power module device manufacturers with typical failure modes and how to solve them using a flux-less soldering process resulting in very low voiding using a reliable formic acid or forming gas option.
