Industrial Electronics

Webinar: Solving power module failure modes using low-void solutions

26 February 2021

Palomar Technologies, a total process solutions provider for advanced photonics and microelectronic device packaging, announced that SST Vacuum Reflow Systems, a Palomar Solution company is offering a webinar on the typical power module failure modes and how to solve them.

Power modules represent a rapidly growing segment with high-growth applications ranging from electric Source: Palomar TechnologiesSource: Palomar Technologiesvehicles, high-speed rail and large medical devices. The stack of interconnects in power modules are a source of mechanical failures. Removal of heat between the direct bonded copper and baseplate is often the main source of thermal mismatches, making voids in this joint the most pressing challenge for power module manufacturers.

SST Vacuum Reflow Systems' Alex Voronel will lead the presentation that will take viewers through the challenges facing insulated-gate bipolar transistor power module device manufacturers and outline the typical failure modes and how to solve them. SST offers a flux-less soldering process resulting in less than 1% voiding using a reliable formic acid or forming gas option process to improve time to market.

The webinar will take place on March 3, 2021, at 8 a.m. PST. Attendees can register for the webinar here.

To contact the author of this article, email engineering360editors@globalspec.com


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