Find out how to ensure long-term product reliability with DiaCool

DiaCool for high thermal conductivity applications

Ultra-high performance thermal spreaders made with DiaCool easily adapt to customer designs and are an effective solution for enhancing product reliability in power/RF packaging and laser diode sub mounts.

Efficient thermal management is the key feature for nearly all electronic applications. As sizes shrink and power density increases, legacy materials often generate hot spots caused by insufficient cooling, leading to a loss in performance. Managing these high power dense applications is where DiaCool shines.

In this infrared video, you’ll see DiaCool's heat dissipation performance compared to oxygen-free high thermal conductivity (OHFC) copper. The thermal tabs, suspended in air, are subjected to identical heat sources at the same time, and DiaCool readily outperforms the OHFC copper.

DiaCool delivers a device-friendly coefficient of thermal expansion (CTE) and very high thermal conductivity that can satisfy the most demanding high power density applications. This material exhibits excellent surface quality for all your die attach and soldering needs. DiaCool is easily adaptable to customer specific designs and is a cost-effective solution to increase the long-term reliability of power, RF, laser and any applications where thermal management is vital to long term reliability.

DiaCool is currently available in a copper diamond or silver diamond matrix and can be plated with a variety of plating schemes to meet your specific requirements. It can be used for heat sinks, die tabs and heat spreaders and provides a significant advantage over more conventional laminate or MMC materials.

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