Orbbec has introduce four new 3D imaging camera technologies at CES 2021 that extend the use of cameras under different conditions such as a range of temperatures and under different lighting, from sunlight to darkness.
The company has introduced its first 3D sensor with time-of-flight technology (ToF). The camera is a high-resolution unit that captures details of moving objects and is not affected by ambient lighting conditions. The camera could be used in robotics, surveillance systems or consumer electronics devices. The ToF sensor has a depth-of-field range from 0.2 to 5 meters along with six-axis inertial measurement unit (IMU) motion tracking, multi-camera synchronization support and the ability to be used in complete darkness.
Orbbec has also extended its line of light 3D cameras called Astra+ that offers better thermal performance along with an RGB camera that has been updated from VGA to 1080 p resolution.
An industrial-level 3D camera has also been introduced by Orbbec in partnership with Purdue University. The camera will be available as a white-label OEM product for laboratory and factory applications.
Finally, Orbbec has introduced the Zora P1 processing board for makers and engineers to integrate 3D imagining in a compact, all-in-one solution. The board pairs with its 3D cameras and features 4 GB DDR4 RAM with swappable eMMC memory, expandable MicroSD storage up to 64 GB and more USB, HDMI, RJ45 and Ethernet ports.
“Innovations in 3D imaging, combined with broader advances like 5G, artificial intelligence and ultra-fast processors, are transforming the application landscape for designers and engineers,” said David Chen, co-founder and director of engineering at Orbbec. “Our new camera with time-of-flight (TOF) technology is a great example. Its high resolution and tracking capabilities make it perfect for all kinds of products including fall detection, security, even at-home yoga and exercise products.”
CES 2021 is all-digital and is taking place this week.
