NXP Semiconductors N.V. will use Taiwan Semiconductor Manufacturing Corp's (TSMC's) 5 nm technology for its next-generation automotive semiconductors.
The devices will be used for the computing systems needed for vehicles in the future, specifically for connected cockpits, high-performance domain controllers, autonomous driving, advanced networking, hybrid propulsion control and integrated chassis management.
NXP will adopt N5P, an enhanced version of TSMC’s 5 nm technology that provides about 20% faster speed or about 40% power reduction compared to 7 nm technology.
The 5 nm process manufacturing is TSMC’s most advanced process in volume production technology and will allow NXP to meet the power management and compute power required for future vehicle architectures as well as safety and security needs. Delivery of the first semiconductor based on the 5 nm devices from NXP are expected to arrive in 2021.
Recently, TSMC announced that it plans to build a new 5 nm manufacturing facility in Arizona that will eventually be able to produce 20,000 semiconductor wafers per month. TSMC said it will be one of only two of its kind of facilities capable of producing this type of semiconductor wafer.
