MEMS and Sensors

Honeywell Sensor Kit Accelerates Testing and Evaluation of Industrial Sensors

18 July 2018

At the recent Sensor Expo 2018, Honeywell International Inc. demonstrated its latest sensor evaluation kit that provides an easier way to demonstrate and evaluate Honeywell industrial sensors.

The SEK002 kit allows for the testing of basic board mount pressure sensors, micropressure sensors, Humidicon digital humidity and temperature sensors and particle sensors. The kit interfaces selected sensors to an Arduino Uno Rev3 microcontroller board. Honeywell software controls the Arduino to take readings from the sensor. A sensor could be mounted directly on the SEK001 or remotely connected via wire leads, allowing the sensor to be tested in adverse environments or in a prototype product for proof-of-concept testing.

The SEK002 has sockets and solder pads to receive compatible sensors and the board is plugged into a shield board to the user-provided Arduino board. Jumpers allow the user to select the sensor, supply voltage and interface.

The board expedites development of products with Honeywell sensors to test the product before production. It is also a cost-effective way to learn about the capabilities of Honeywell sensors in order to make decisions faster about which sensor and components to use. This evaluation of the sensors also happens without the need to develop additional code.

At Sensors Expo, Honeywell demonstrated the SEK002 board with its micro-pressure board-mount sensors, showing how the technology can be used to measure partial volume of liquid (in this case it was just water). The small size of the sensor allows for pump control or leak detection in small spaces with a variety of different types of liquid, which is important in the oil and gas industries.

Honeywell’s MPR series is a very small piezoresistive silicon pressure sensor that offers a digital output for reading pressure over the specified full-scale pressure span and temperature range. The device is targeted at the medical industry as well as commercial applications.

To contact the author of this article, email PBrown@globalspec.com


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