Leti to Demonstrate New Curving Technology That Improves Performance of Optical Components at Photonics West

18 January 2018

At SPIE Photonics West in San Francisco, Jan. 27-Feb. 1, Leti will demonstrate its new curving technology for Source: LetiSource: Letioptical components that improves performance, enhances field of view and compensates for optical aberrations.

PIXCURVE is one of several state-of-the-art developments that Leti will demonstrate at booth 431 in the Moscone Center. The topic also is one of 20 papers Leti will present during the conference.

PIXCURVE is a proof of concept for optical components such as microdisplays, visible imagers and cooled infrared sensors used in mobile phones, telescopes, medical-imaging tools, IR sensors and other imaging applications. In addition to improving performance, the curving technology minimizes the vignetting effect that reduces brightness on the borders of images, and it makes cameras, imagers and microdisplays lighter and more compact.

The technology can be used to curve components such as CMOS imagers and charged-couple device (CCD) imagers for mobile phones, cameras, medical equipment and industrial-control equipment. Other uses include IR sensors for astronomy, defense, drones and microdisplays for automotive applications, augmented reality and virtual reality.

Leti Workshop: "More Than Reality"

Barry Silverstein, optics research scientist manager at Oculus VR, the Facebook subsidiary that focuses on virtual reality products, will kick off Leti's Jan. 31 photonics workshop and networking reception for invited guests at 5:30 p.m. in the W Hotel, 181 3rd St., in San Francisco. His keynote presentation is titled "Photons Matter: The Key to Quality VR and AR."

Leti presentations at the workshop will highlight the institute's latest results in better sensing, communication and display technologies:

  • Introduction by Ludovic Poupinet, head of Leti's Optics and Photonics Division
  • "New Generation of Display for a Smarter World," Sylvie Joly, business developer/ displays
  • "Silicon Photonics for High Bandwidth Communications," Laurent Fulbert, business manager
  • "Miniaturization Challenges in Optical Sensing," Sergio Nicoletti, business developer/sensors
  • "Lens-free Microscopy of Viruses, Bacteria, Cells and 3D Cell Culture," Cédric Allier, project manager, health and biology

The paper highlighting PIXCURVE technology, "Curved sensors for compact high-resolution wide-field designs: prototype demonstration and optical characterization," will be presented at 2:40 p.m. Thursday, Feb. 1. Leti researchers also will present 20 additional papers, including three invited papers:

Jan. 28

  • Microfluidics, BioMEMS, and Medical Microsystems XVI / Applications I

"1 million-Q optomechanical microdisk resonators for sensing with very large scale integration” 8:40 a.m. Room 2020 (WEST LEVEL 2)

Jan. 29

  • Advanced Biomedical and Clinical Diagnostic and Surgical Guidance Systems XVI / Diffuse Reflectance Techniques for Clinical Applications

"CMOS-based contact imaging system for spatially resolved diffuse reflectance spectroscopy" 9:50 a.m. Room 2003 (WEST LEVEL 3)

  • Three-Dimensional and Multidimensional Microscopy: Image Acquisition and Processing XXV / Holography and Scatterometry

"3D+time acquisitions of 3D cell culture by means of lens-free tomographic microscopy" 10:50 a.m. Room 2010 (WEST LEVEL 2)

  • Imaging, Manipulation, and Analysis of Biomolecules, Cells, and Tissues XVI / Functional Imaging

"Label-free cell viability assay using lens-free microscopy" 11:30 a.m. Room 2024 (WEST LEVEL 2)

  • Translational Research Applications

"Elastic light scattering for clinical pathogens identification: application to early screening of Staphylococcus aureus on specific medium" 11:30 a.m. Room 3001 (WEST LEVEL 3) (Invited paper)

  • Silicon Photonics XIII / Fabrication and Manufacturing

"Optimization of H2 thermal annealing process for the fabrication of ultra-low loss sub-micron silicon-on-insulator rib waveguides" 11:40 a.m. Room 208 (SOUTH LEVEL 2)

"200mm full CMOS-compatible hybrid III-V/Si laser process integration on a mature silicon-photonic platform" 12 p.m. Room 208 (SOUTH LEVEL 2)

  • Frontiers in Biological Detection: From Nanosensors to Systems X / Novel Imaging Tools for Biodetection

"Lens-free microscopy of cerebrospinal fluid for the laboratory diagnosis of meningitis" 2 p.m. Room 3005 (WEST LEVEL 3)

  • Integrated Optics: Devices, Materials, and Technologies XXII / Nonlinear Photonics I

"SiNOI and AlGaAs-on-SOI nonlinear circuits for continuum generation in Si photonics" 2 p.m. Room 314 (SOUTH LEVEL 3)

Jan. 30

  • Free-Space Laser Communication and Atmospheric Propagation XXX / Receiver Architectures and Components

"HgCdTe APDs for free space optical communications" 3:30 p.m. Room 158 (SOUTH MEZZANINE)

  • Light-Emitting Diodes: Materials, Devices, and Applications for Solid State Lighting XXII / LED Manufacturing and Novel Substrates for LED Epistructure Growth

"Strain release effect in full InGaN structure for long wavelength emission 11:40 a.m. Room 207 (SOUTH LEVEL 2) (Invited Paper)

  • Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and Applications XI / Terahertz Imaging and Volume Inspection

"Towards industrial applications of terahertz real-time imaging" 3 p.m. Room 305 (SOUTH LEVEL 3)

  • Light-Emitting Diodes: Materials, Devices, and Applications for Solid State Lighting XXII / LED Applications and Solid-State Lighting II

"Nanoparticle-based microstructures for light extraction enhancement in nitride LEDs" 2:50 p.m. Room 207 (SOUTH LEVEL 2)

Jan. 31

  • Silicon Photonics XIII / Light-Emitting Structures

"GeSn lasers for mid-infrared silicon photonics" 10:30 a.m. Room 208 (SOUTH LEVEL 2) (Invited Paper)

  • High Contrast Metastructures VII / Metasurface Imaging and Holograms

"Simulation method for large subwavelength devices in infrared imaging systems and comparison with experiment" 11:20 a.m. Room 2002 (WEST LEVEL 2)

Feb. 1

  • Integrated Optics: Devices, Materials, and Technologies XXII / Planar Lightwave Circuits

"O-band Echelle grating CWDM demultiplexers on SiNOI exhibiting quasi-absolute thermal insensitiveness" 11:30 a.m. Room 314 (SOUTH LEVEL 3)

  • Photonic Instrumentation Engineering V / Innovative Photonics Instrumentation III

"Curved sensors for compact high-resolution wide-field designs: prototype demonstration and optical characterization" 2:40 p.m. Room 312 (SOUTH LEVEL 3)

  • Advances in Display Technologies VIII / Emissive Displays

"High-resolution active-matrix 10-μm pixel-pitch GaN LED microdisplays for augmented reality applications" 11 a.m. Room 157 (SOUTH MEZZANINE)

Posters Jan. 29

"Dynamic quantitative analysis of adherent cell culture by means of lensfree video microscopy" 5:30 p.m. to 7:30 p.m. MOSCONE WEST LEVEL 2 & 3

"Phase contrast imaging from defocused images" 10:40 a.m. to 12:30 p.m. Room 2000 (WEST LEVEL 2)

To contact the author of this article, email shimmelstein@globalspec.com

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