Acquired Electronics360

Industrial Electronics

New Bluetooth Module Accelerates Development Time of Bluetooth Energy in IoT

06 September 2017

Source: Laird TechnologiesSource: Laird Technologies

Mouser Electronics is now stocking the SaBLE-x-R2 Bluetooth® 5 module from Laird Technologies. The SaBLE-x-R2 module builds on the hardware of the SaBLE-x module. The new module aims to accelerate the development time associated with implementing Bluetooth low-energy connectivity in internet of things (IoT) sensors and could be used in commercial, medical and industrial applications.

The Laird SaBLE-x-R2 module comes with an external or PCB trace antenna and takes advantage of the range, speed and throughput of the Bluetooth 5 specification and includes increased flash memory for application usage and over-the-air capabilities. The module is based on the Texas Instruments SimpleLink™ CC2640R2F wireless microcontroller. This module is self-contained and integrates an Arm® Cortex®-M3 application processor, Arm Cortex-M0 processor for radio frequency (RF) core, Sensor Processor Engine and high and low-speed clocks. It is designed to remove complexity and accelerate development time. It is pin-to-pin compatible with the original SaBLE-x hardware. This means upgrading to R2 doesn’t require any PCB footprint or hardware changes in the existing SaBLE-x board layout.

The SaBLE-x-R3 module comes with certification compliance with the Federal Communications Commission, Industry Canada, CE, Giteki and C-Tick regulatory bodies and qualification with Bluetooth SIG. The module is supported by the SaBLE-x-RE BLE development kit that provides all the necessary connectors, jumpers, indicators and switches to test and debug aspects of the SaBLE-x-R2 module.

To learn more about this module, visit Mouser.

To contact the author of this article, email

Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter


Date Event Location
12-16 Aug 2018 Vancouver, Canada
11-13 Sep 2018 Novi, Michigan
27 Sep 2018 The Reef, Los Angeles
03-05 Oct 2018 Boston, Massachusetts
26 Oct 2018 Old Billingsgate
Find Free Electronics Datasheets