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Aerospace

Molex, TE Connectivity Team Up on Next-Gen Datacom Connectors

16 December 2016

Global interconnect suppliers Molex and TE Connectivity have announced a Dual Source Alliance (DSA) agreement to each produce a new generation of high-speed input/output (I/O) and backplane connectors, as well as cable assemblies for data communications applications.

Both companies will collaborate on the launch and promotion of select new connector and cable assembly products that enable the growing number of high-speed applications required, as data centers evolve with hyperscale models and increased virtualization. The DSA will support today’s data speeds and up to 56 Gbps and beyond. The scope of the agreement includes next-generation connector products, and the DSA is intended to build on the successful history with standard second source agreements for products such as: zSFP+ interconnects, zQSFP+ interconnects, CDFP interconnects, microQSFP interconnects and Nano-Pitch I/O interconnects.

The DSA goes well beyond each company simply producing similar products. It is focused on creating increased availability of high-speed solutions—composed of connectors, cages and cable assemblies—that are interoperable. The DSA includes self-testing: TE and Molex will conduct cross-testing of select products and provide these test reports to customers. This will provide an assurance of product compatibility and help customers minimize their qualification time. Overall this can result in cost savings for customers, improving the productivity and efficiency of their systems. Also TE and Molex will bring products covered under the DSA to market in a shorter timeframe to better support customers’ design and qualification processes.

Data centers are rapidly evolving to deliver higher density, higher speeds and richer virtualization models. High-performance, high-speed connectors and cable assemblies must support the system data requirements of new data storage, servers, switches, routers and other applications. These connectivity products typically offer superior high-speed electrical performance, which in turn requires sophisticated connector and cable assembly designs with advanced features for high-speed signaling, EMI containment and thermal efficiencies.

The Molex and TE alliance aims to produce connectors and cable assemblies with these vital characteristics. This agreement is intended to offer increased product availability to customers and reduce the risk of new technology adoption by providing customers with the choice of two independent suppliers with interoperable products.



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