Semiconductors and Components

Thermal Interface Material Handles Surface and Shape Variations

02 February 2016

Fujipoly has introduced Sarcon PG80A, a high-performance, low compression force putty-like thermal interface material. The 13 W/m°K gap filler pad conforms to most component shapes and uneven surfaces to transfer heat from its source to a nearby heat sink or spreader while exhibiting a thermal resistance as low as 0.08°C in2/W at 14 PSI.

This advanced formulation suits applications that have delicate or wide-variation component heights and require material compression between 30% and 90%. PG80A is available in four sheet thicknesses (0.5, 1.0, 1.5 and 2.0 mm) up to a maximum dimension of 300 mm x 200 mm. Sarcon® PG80A can also be ordered in die-cut form to fit almost any application shape. The material is suited for environments with operating temperatures that range from -40 to +150 °C and exhibits a UL94 flame retardant rating of V-0.

Fujipoly’s Sarcon PG80A thermal interface material (Source: Fujipoly).Fujipoly’s Sarcon PG80A thermal interface material (Source: Fujipoly).

Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the GlobalSpec
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter