Acquired Electronics360

Mobile Devices

Motorola V3xx RAZR Mobile Phone Teardown

02 April 2007
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

Main Features

Mid to high-end clamshell 3G UMTS 1900/2100 / Tri-band GSM HSDPA/EDGE/GPRS phone. Main features include a single 1.3MP camera (other non-Cingular versions have a secondary VGA module for video calling), a 2.2 240 x 320 262K color TFT display. The phone also hase built-in Bluetooth V2.0 (EDR) connectivity, and a generous dose of resident memory with 512Mbits each of NOR Flash, NAND Flash, and SDRAM, as well as a MicroSD memory extension slot.

Motorola V3xx RAZR Mobile Phone Main ImageMotorola V3xx RAZR Mobile Phone Main Image


The V3xx is yet another version of the now well-milked and somewhat tired-looking RAZR design. This version does feature HSDPA 3.6 Mbit/s data rate as well as EDGE, bearing in mind that most of the HSDPA devices we have seen in the last year have been 1.8 Mbit/s. So in terms of this feature it handily beats other RAZRs from that perspective. It also features the previously unseen Nvidia GoForce 4800 GPU. Previous Motorola models have featured other Nvidia GoForce GPUs.

Also, although the V3xx is tooled to be a dual camera phone, the Cingular version analyzed featured only a single 1.3MP primary camera module.

Indeed, the implementation of HSDPA now allows for more media (music specifically) downloading capability and also improves web browsing capability, etc. and therefore it seems that media phones should logically become more and more of a 'threat' to stand alone MP3 players, which may also explain Apple's recent move to the iPhone, as they likely see the forthcoming issue to become how and where users download their 'tunes', which HSDPA is facilitating for service providers and phone users.

The V3xx also competes, more or less with, amongst other models in Cingular's portfolio, the Samsung SYNC (SGH-a707), analyzed in parallel with this device. One notable difference between the two: the Samsung SYNC, based on Qualcomm's MSM6275 chipset is limited to HSDPA 1.8Mb/s functionality, whereas the V3xx is capable of operating at the newer 3.6Mb/s data rate. However, at the time of writing of this (3/28/07), it seems that the difference, for Cingular subscribers at least, is irrelevant as their network operates at the 1.8 Mb/s rate currently.

Target Market

Mainstream users interested in media downloading / streaming features which take advantage of new HSDPA high speed network.


Per Motorola press release - Q3 2006.

Pricing and Availability

$39.99 after rebates with 2-year service contract (as of 3/28/07).

Volume Estimations

For the purposes of this teardown, we estimate unit shipments for the V3xx over the course of an 18 month to 2 year production lifetime would be on an order of magnitude around 1.7 million units.

As a reminder, volume production assumptions are not meant to be necessarily 'market accurate', but are meant primarily to be used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially).

ISuppli's Design Forecast Tool (DFT) and Market Shares

As part of iSuppli's Design Forecast Tool (DFT), we forecast handset shipments by major design feature and manufacture, as well as the number of design starts a manufacturer will have by feature set.

HSDPA is a relatively new entrant in the market and has, per iSuppli estimations from our current DFT at the time of this publication, achieved minimal shipment volume levels in 2006, and although it will grow rapidly, we still only forecast, from our Design Forecast Tool (DFT), unit shipments of approximately 11 million units in 2007, growing to 28 million units in 2008, with Motorola shipping about 2 of the 11 million units total in 2007, and nearly 5 of the 28 million total units shipped in 2008.

Based on our design start and product launch data from DFT, Motorola has a total of about half a dozen HSDPA models in their portfolio in the 2006-2007 timeframe.

Function / Performance

No testing was performed on this unit.

Motorola V3xx RAZR Mobile Phone Cost AnalysisMotorola V3xx RAZR Mobile Phone Cost Analysis

Cost Notes

Main Cost Drivers Representing ~72% of total materials cost as follows :

Freescale chipset

SC29432VZ0 - DBB - Digital Baseband Processor

MC13783VK5 - ABB - Analog Baseband / Power Management

MMM6007 - RF Transceiver - Tri-Band, WCDMA 850/1900/2100MHz

MMM6000 - RF Transceiver - ZIF, Quad-Band, GSM/GPRS/EDGE, w/ Integrated LNAs & VCOs


Spansion - S98WS512NFFFW008 - MCP - 512Mb NOR Flash + 512Mb Mobile DDR SDRAM + 512Mb NAND Flash, PoP


Primary Display Module - 2.2' Diagonal, 262K Color TFT, 240x320 Pixels

Wintek - WD-X0908V-6CNN9 - Secondary Display Module Value Line Item - 1' Diagonal, 65K Color STN, 80x96 Pixels

Camera Module

Camera Module - 1.3MP CMOS, 1/3' Format - Fixed Lens


Nvidia - GoForce 4800 - GPU - Support 3MP Camera, 3D Processing


Display Area PCB - 4-Layer - Kapton/RCF HDI

Compeq - Main PCB - 10-Layer - FR4/RCF HDI, 2+6+2

Keypad PCB - Flex Kapton


Motorola - BZ60 - Battery - Li-Ion, 3.7V, 900mAh

Other Items

Skyworks - SKY77413 - Transmit Module - PAM - WCDMA/HSDPA 850MHz, 824-849 MHz, 23.9dBm, Integrated TX Filter & Duplexer

TriQuint Semiconductor - TQM666017 - Transmit Module - PAM - WCDMA/HSDPA 1900MHz, w/ Integrated TX Filter & Duplexer

Broadcom - BCM2045 - Bluetooth - Single Chip HCI Solution, V2.0 EDR, 0.13um

Total BOM & Manufacturing Costs (Direct Materials + Conversion Costs) ~$137

What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing and test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

Country of Origin / Volume Assumptions

Most Motorola product is labeled as Made in China. We have assumed that for the V3xx, that not only final assembly, but also PCB population, and custom mechanicals (plastics and metals) were all sourced or manufactured domestically in China.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as chargers), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

The issue of labor rates was revisited in Q2 2006 as we began to apply some research by one the major worldwide EMS suppliers and are now applying some of their research on total loaded costs by country and region to arrive at these new rates which are pronouncedly higher on the low end in China. Remember that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines.

Design for Manufacturing / Device Complexity

The total component count of the Motorola V3xx is 808, which puts it at the high end when compared with other higher-end clamshell phones. This count includes the subcomponents of the camera module, but not the display, which is accounted for as a single deliverable. Mechanically, the Motorola V3xx is also inline with other clamshell phones (which are always more mechanically complex and thus with increased components count) at a total mechanical component count of 137.

The original RAZR V3 that we analyzed when the RAZR model was new only came in at 577 components, of which 136 were mechanical. This makes sense, as the physical aspects of the phone are should remain largely unchanged, while the electronics may indeed increase as feature sets are increased, however this is usually offset through ongoing integration.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Design Notes

The core of this design is based on a previously unseen Freescale digital baseband (SC29432VZ0) that supports the latest HSDPA 3.6 Mb/s data rates, so is assumed to be (although no data sheet was found for this product) quite new from Freescale, and likely built in 90nm or possibly even 65nm process geometry. It's no surprise, of course, to find Motorola phones built on Freescale parts - it's somewhat expected and the norm. It's interesting to note that the memory MCP was actually piggybacking (PoP - or Package on Package) the DBB chip, and most likely came pre-assembled that way before being surface mounted to the main PCB. This manner of improving the real estate factor within the phone on the PCB is becoming more popular and we have seen this in several recent cases, primarily with apps processors, such as the 'X-scale' processors from Intel (Marvell).

It's also worth noting, that while many Motorola phones we have seen use Nvidia GoForce series mobile GPUs, we did not see this in previous RAZR analyses, nor have we seen this exact model (GoForce 4800) in other phones.

Other than these, the majority of RF/PA functionality is provided, where possible, by Freescale chips and is part of an overall chipset solution / reference design from Freescale - part of their ?Comprehensive Radio Solutions

RFX300-20 RF Subsystem - Fourth Generation WCDMA/EDGE Radio".

Here is a summary of the major components used in the Motorola V3xx design:

Main PCB Baseband

DBB - Digital Baseband Processor - Freescale - SC29432VZ0 (note that memory MCP below is directly stacked on the DBB)

ABB - Analog Baseband / Power Management - Freescale - MC13783VK5


Spansion - S98WS512NFFFW008 - MCP - 512Mb NOR Flash + 512Mb Mobile DDR SDRAM + 512Mb NAND Flash, PoP (this device is actually stacked directly on top of the DBB chip and is probably delivered that way).


RF Transceiver - ZIF, Quad-Band, GSM/GPRS/EDGE, w/ Integrated LNAs & VCOs - Freescale - MMM6000

RF Transceiver - Tri-Band, WCDMA 850/1900/2100MHz - Freescale - MMM6007

PAM - Quad-Band GSM/GPRS/EDGE - Freescale - MMM6029

Transmit Module - PAM - WCDMA/HSDPA 1900MHz, w/ Integrated TX Filter & Duplexer - TriQuint Semiconductor - TQM666017

User Interface

GPU - Nvidia - GoForce 4800 - Supports up to 3MP Camera, 3D Processing

Bluetooth - Broadcom - BCM2045 - Single Chip HCI Solution, V2.0 EDR, 0.13nm

Camera Module

Image sensor - Manufacturer Unknown - 1.3MP, CMOS, 1/3' Format - 3.6um x 3.6um Pixel Size, 4.60mm x 3.70mm Active Image Area

Display Module

  • 2.2' Diagonal, 262K Color TFT, 240 x 320 Pixels

Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter


Date Event Location
04-07 Jun 2018 Boston, MA
06-08 Jun 2018 Los Angeles, CA
18-22 Jun 2018 Honolulu, Hawaii
12-16 Aug 2018 Vancouver, Canada
11-13 Sep 2018 Novi, Michigan
Find Free Electronics Datasheets