Acquired Electronics360

Mobile Devices

Samsung SGH-X700 Mobile Phone Teardown

16 January 2007
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

Main Features

Mid-high end tri-Band GSM/GPRS/EDGE candy bar phone with a 1.9 262K Color TFT display, a 1.3MP camera, and a MicroSD memory card slot. On top of these, it also features FM radio, Bluetooth and dual-speaker.

Samsung SGH-X700 Mobile Phone Main ImageSamsung SGH-X700 Mobile Phone Main Image


The SGH-X700 is Samsung's first megapixel camera candy-bar phone. It maintains the sleek and cool design from the previously successful SGH-D500 while giving up the ""sliding" mechanism. In terms of features, it adds a FM radio and a MicroSD memory card slot to what the D500 had. The X700 is the fully-loaded version of the D500.

Target Market

Mainstream audience - this kind of phone has a features set that is placing it nowadays in what has become a mid-range phone.


Nov 2005 - per press release from Samsung.

Pricing and Availability

A few samples of prices found for this device include: 140 - 'pay as you go' from Orange, UK. $280 USD from unknown online retailer - unclear if unlocked. $180 for unlocked gray market phone, US.

Volume Estimations

Samsung has a significant market position worldwide in terms of unit shipments. ISuppli estimates that their unit shipment market share for 2006 will be nearly 13%, and will very gradually grow but remain stable in that range for years to come.

Our production volume assumptions are derived from several sources including iSuppli's Design Forecast Tool (DFT) and other wireless area research. Based on iSuppli's estimates we arrived at our assumption of approximately 200,000 units produced over the production lifespan (generally assumed at 2 years for handsets). For the purposes of this analysis, we upped this estimate to 500K units based on customer feedback. Our low figures are representative overall of our low forecast for EDGE handsets from Samsung

As a reminder, volume production assumptions primarily affect our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially).

Design Forecast Tool Notes

Per iSuppli research we estimate total Samsung shipments of 2M tri-band (900/1800/1900) EDGE handset shipments in 2006 with the introduction of 11 tri-band (900/1800/1900) handset models in 2005 and we estimate a total of 10 tri-band (900/1800/1900) handset models to be introduced in 2006.

Function / Performance

No testing was performed on the Motorola Samsung SGH-X700.

Samsung SGH-X700 Mobile Phone Cost AnalysisSamsung SGH-X700 Mobile Phone Cost Analysis

Samsung SGH-X700 Mobile Phone Cost Analysis
Cost Notes

Main Cost Drivers Representing approximately 76% of total materials costs

Samsung - Display Module - 1.9' Diagonal, 262K Color TFT, 176x220 Pixels

Samsung - MCP - 256Mb NOR Flash + 512Mb OneNAND Flash + 128Mb UtRAM

Philips Semiconductor - Baseband Processor - Single Chip, Quad-Band GSM/GPRS/EDGE

Camera Module - 1.3MP CMOS, 1/3.2' Format - Fixed Lens

Samsung - Bluetooth V1.2 Module Line Item Value

Daeduck - Main PCB - 8-Layer - FR4/RCF HDI, 2+4+2

Samsung - Battery - Li-Ion Polymer, 3.7V, 900mAh

Mtekvision - Video / Image Processor

High Intensity White LEDs

Charger - 5V, 700mA

Philips Semiconductor - RF Transceiver - SiP, Near-ZIF, Tri-Band: GSM/GPRS/EDGE

Yamaha - FM Sound Synthesizer

TriQuint Semiconductor - PAM - Quad-Band, GSM/GPRS/EDGE

Keypad Assembly

FEM - Tri-Band, 4 RF PIN Diode Antenna Switch + 2 RX RF SAW filters (GSM900, DCS1800, PCS1900)

Philips Semiconductor - FM Radio

Materials and Manufacturing*

* - The total materials and manufacturing costs reported in this analysis reflect only the direct materials cost (from component vendors and assorted EMS providers), manufacturing and test. Not included in this analysis are costs above and beyond the manufacture of the core device itself - cost of shipping, logistics, marketing and other channel costs including not only the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device (phone, battery, charger, some accessories, and packaging and literature) itself.

Manufacturing Notes

Country of Origin / EMS provider

This Samsung SGH-X700 was produced (final assembly, that is) in Korea, per markings on the device itself. Samsung, with it's vertical integration, seems to produce largely locally within Korea, except for power supplies, so with repesct to subassemblies, unless specifically labeled, it was assumed that PCBAs and plastics, etc are also from Samsung suppliers and EMS providers in Korea. However, we generally assume that where not noted, that sub-assemblies and some custom manufactured items (plastics, mechanicals, etc.) will be produced in the lowest cost region in the absence of proof to the contrary. This is not known - and these are merely assumptions.

Design for Manufacturing / Complexity

The total component count of the SGH-X700 at 543 components is well within the norms of the spectrum with respect to other clamshell designs - especially considering a relatively rich features-set.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design.

The cost of manufacturing is also affected by the assumed production volumes (which increase or decrease the per unit amortized cost of certain NRE, tooling and other up-front charges), as well as the country of final assembly, being Germany in this case, where our assumed loaded skilled (technical) and semi-skilled labor rates is one of the highest worldwide.

Design Notes

The Samsung SGH-X700 features a mixture of major ICs previously seen from other Samsung phones that we have analyzed. Philips single chip baseband and power management IC are used as in SGH-E340E & SGH-D500. The Samsung MCP memory is also pretty typical in Samsung's design. For the power amplifier, this is the second time we see a TriQuint device. In the D500, a Philips's PAM was presented and in fact was the only time that we saw a Philips device. Other than that, most PAMs have been from Skyworks and RF Micro Devices. RF transceiver is also from Philips which is again not unusual in Samsung phones. In the user interface section, the CSR Bluetooth chip and the Yamaha sound synthesizer are not new comer. However, the FM radio IC from Philips is a first timer as the X700 is the first Samsung phone (among those we have analyzed) equipped with FM radio.

Here is a summary of the major components used in Samsung SGH-X700 design:

Main PCB


  • Philips Semiconductor - PCF5213 - Baseband Processor - Single Chip, Quad-Band GSM/GPRS/EDGE, Dual-Mode UMTS

Battery / Power Management

  • Philips Semiconductor - PCF50603 - Power Management IC
  • Linear Technology - LTC4075 - Battery Charger - Linear Li-Ion, Dual Input USB/AC


  • Samsung - KAP17SG00A-D4U4 - MCP - 256Mb NOR Flash + 512Mb OneNAND Flash + 128Mb UtRAM


  • TriQuint Semiconductor - TQM7M5004 - PAM - Quad-Band, GSM/GPRS/EDGE

RF Transceiver

  • Philips Semiconductor - UAA3587 - RF Transceiver - SiP, Near-ZIF, Tri-Band: GSM/GPRS/EDGE

User Interface

  • CSR - BC313141A19 - BlueCore3 Gateway - Single Chip Bluetooth Solution, Pb Free
  • Philips Semiconductor - TEA5761UK - FM Radio
  • Yamaha - YMU762C-QZ - FM Sound Synthesizer

Camera Module

  • Camera Module - Manufacturer Unknown
  • Image Sensor - Samsung - S5K3AAEA03 - 1.3MP, CMOS, 1/3.2' Format - 3.5um x 3.5um Pixel Size, 4.8mm x 3.8mm Active Image Area

Display Module

  • Samsung - LTS190QC - 1.9' Diagonal, 262K Color TFT, 176x220 Pixels


Samsung SGH-X700 Mobile Phone - Device Bottom View w/ Enclosure RemovedSamsung SGH-X700 Mobile Phone - Device Bottom View w/ Enclosure Removed

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