Viliv X70 EX Mobile Internet Device Teardown

Overview / Main Features

The Yukyung Technologies Viliv X70 EX, is both a mobile internet device (MID) and personal media player (PMP) which is built around the Intel Atom Z520 CPU and the US15W chipset. According to Intel, the Z5xx series (as opposed to the more netbook typical N270) of Atom processors are lower power consuming CPUs that are intended for UMPCs and MID devices.

The Viliv clearly tries to distinguish the X70 EX as a PMP and MID, as opposed to another one of the myriad of netbooks in the market, with its notable omission of a keyboard. Without the use of the keyboard the device does not have much usability outside of light Internet browsing and as a media player. The X70 EX is quite similar to the Dell Inspiron 1010 netbook, which also contains the same processor, chipset, and same amount of memory - but the Dell was a conventional netbook enclosure rather than a tablet or UMPC touch format device.

The Viliv X70 EX also comes equipped with 1GB of DDR2 SDRAM, GPS functionality, Bluetooth 2.0+EDR, 802.11 b/g connectivity, a camera, 16GB solid state drive, and 7 1024 x 600 TFT w/ resistive touchscreen. The X70 EX runs Windows XP Home Edition.

About Yukyung their own press boilerplate: ""Based in Korea, Yukyung Technologies is a worldwide leader in the Mobile device and communications market sector with strengths in technology development, product design, manufacturing quality, as well as solution design and implementation. Yukyung Technologies was founded in 1999 and has developed viliv brand of PMP, Navigator in 2005 and now it's one of the best and leading Mobile Internet Device Manufacturer in the world."

Viliv X70 EX Mobile Internet Device Main Image

High End MID/PNDs consumers

Released

Per press releases, first release in 2009 on July 6.

Viliv X70 EX Mobile Internet Device - Motherboard Top

At the time of this writing, this particular Viliv X70 EX model sells for approximately $600.

Availability - Available worldwide.

Volume Estimations

For the purposes of this teardown analysis, we have assumed a lifetime production volume of 800,000 units.

As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

Viliv X70 EX Mobile Internet Device - Motherboard Bottom

Main Cost Drivers Representing ~75% of total materials cost

Intel - AC80566UE014DW - CPU - Intel Atom Z520, 1.33GHz, 512KB L2 Cache, 533MHz FSB, 45nm

Samsung Semiconductor - K9LBG08U0M-PCB0 - Flash - NAND, MLC, 32Gb (Qty:3)

Yukyung Technologies - Battery Pack - Li-Polymer, 7.4V, 4100mAh

Chunghwa Picture Tubes, Ltd - CLAA070NC0BCT - Display Module Value Line Item - 7.0' TFT LED Backlit LCD, 1024x600 (WSVGA), 153.6 x 90.0mm Active Area, 400:1 Contrast Ratio, 300 cd/m^2 Brightness, 5ms Response Time

Intel - AF82US15W - System Controller Hub - US15W, 400MHz/533MHz FSB

Simm Tech Co., Ltd. - 10-Layer - FR4/RCF HDI, 2+6+2, Lead-Free

Samsung Semiconductor - K9LBG08U0M-PCB0 - Flash - NAND, MLC, 32Gb

Samsung Semiconductor - K4T1G164QQ-HCE6 - SDRAM - DDR2-667, 1Gb (64Mx16), 1.8V (Qty:4)

Wi2Wi - W2CBW003 - WLAN / Bluetooth - SiP, 802.11b/g, V2.0+EDR, Contains Marvell 88W8686 & CSR BlueCore4

Samsung - GPD17B01-007 - GPS Module Value Line Item - Contains SiRFstarIII GPS Chipset

Samsung Semiconductor - K4T1G164QQ-HCE6 - SDRAM - DDR2-667, 1Gb (64Mx16), 1.8V (Qty:3)

Camera Module Value Line Item - 1.3MP, CMOS, 1/5' Format, Fixed Lens

SiRF - GSC3f/LP - GPS - SiRFstarIII, 50MHz ARM7TDMI CPU, 1Mb SRAM, 4Mb Flash, 20-Channel GPS, 3V, 10 GPIO Ports

Fujitsu - MB39C308 - Power Management IC for UMPC

Touchscreen Overlay - 7', 4-Wire Resistive, PET Film over ITO Glass, w/ Integral Flex PCB

Total BOM Costs $239.20

Viliv X70 EX Mobile Internet Device Cost Analysis

What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

Country of Origin / Volume Assumptions

Based on markings, the unit was assembled in Korea. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in Korea.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as LCD display), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. ""Auto" inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Viliv X70 EX Mobile Internet Device - Enclosure Disassembly

Design for Manufacturing / Device Complexity

The Viliv X70 EX has an overall component count of 1447 (excluding box contents), of which, 191 are mechanical in nature.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for Korea.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Design Notes

The Viliv X70 EX is the second device we have seen with the Intel Atom Z520 and integrated System Controller Hub US15W platform. However, unlike the Dell Inspiron 1010, which had the CPU and System Controller Hub on a separate PCB with the SDRAM from the motherboard, the X70 EX has them on the motherboard. This reflects its intended use as a MID/PMP. The 16GB SSD resides on a separate PCB with four 32Gb NAND MLC chips made by Samsung Semiconductor. The WLAN and Bluetooth are integrated on to a single chip. The Viliv X70 EX runs Windows XP with Viliv's own custom launcher.

Here is a summary of the major components of the Viliv X70 EX mobile internet device / personal media player

Main PCB

CPU

• CPU - Intel - AC80566UE014DW - Intel Atom Z520, 1.33GHz, 512KB L2 Cache, 533MHz FSB, 45nm

Chipset

• System Controller Hub - Intel - AF82US15W - US15W, 400MHz/533MHz FSB

I/O & Interface

• Touch Screen Controller - Texas Instruments - TSC2008IRGVR - 4-Wire, 12-Bit, Low Voltage, w/ I2C Interface
• Audio Codec - IDT - IDT92HD75B2X3NLGXYBX - 4 Channel, High Definition
• Video Encoder - Chrontel - CH7022A-TEF - SDTV / HDTV, Multiformat

Memory

• Memory - Samsung Semiconductor - K4T1G164QQ-HCE6 - DDR2-667, 1Gb (64Mx16), 1.8V

WLAN/Bluetooth

• WLAN / Bluetooth - Wi2Wi - W2CBW003 - 802.11b/g, V2.0+EDR

GPS

• GPS - SiRF - GSC3f/LP - SiRFstarIII, 50MHz ARM7TDMI CPU, 1Mb SRAM, 4Mb Flash, 20-Channel GPS, 3V, 10 GPIO Ports

Display

• Display Module - 7.0" Diagonal, 16.7M Color TFT Color LCD, 1024 x 600 pixels

Storage

• SSD - Samsung Semiconductor - K9LBG08U0M-PCB0 - NAND, MLC, 32Gb

Viliv X70 EX Mobile Internet Device - Box Contents