Overview / Main Features
The Archos 9 pctablet is a fully functional touchscreen-only tablet PC that is running Windows 7, and is architecturally based around an Intel Atom Z510 1.1 GHz processor and single chip 'chipset' support. The core Atom processor shares the same die size and package as the Z520 seen recently in another tablet device, so it appears that the differences between the Z520 and Z510 (being 1.3GHz vs 1.1GHz) are soft differences.
In addition to these basic features, the Archos 9 features an 8.9 inch TFT display with a basic, inexpensive 4-wire resistive touchscreen overlay requiring a stylus - but this appears to be the norm still for other MIDs. Apple's forthcoming iPad is expected to feature a very pricey large format glass capacitive multitouch screen, which brings with it a significant cost that most other manufacturers competing in this space have yet to adopt, because of the price tag most likely.
Otherwise, from a hardware perspective, the Archos 9 features most of the little bits you would expect from a netbook, such as built in 60GB HDD, 1.3MP camera module, WiFi /Bluetooth and an optical trackpad, similar to those employed in the most recent RIM/Blackberry devices.
Tablet PCs, and other touchscreen-based devices broadly defined as Mobile Internet Devices seem to be the flavor of 2010, and it's too early to tell how these devices morph, cannibalize or just transform the netbooks and mobile devices space.
High end consumers of mobile computing.
Released
Per press release - October 22nd, 2009.
At the time of this writing, this particular Archos 9 model configuration sells for $549.99 from Archos.
Availability - Available worldwide.
Volume Estimations
For the purposes of this teardown analysis, we have assumed a lifetime production volume of 750,000 units, which is likely generous in light of Archos' modest financials. However, for the purposes of this analysis, we are applying this volume more to put their pricing on closer footing to larger rivals.
As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.
Main Cost Drivers Representing ~80% of total materials cost
Toshiba Storage Device - MK6028GAL - Hard Drive - 60GB, PATA, 100MB/s, 1.8', 4200rpm, 2MB Buffer
HannStar - HSD089IFW1-A - Display Module Value Line Item - 8.9' TFT LED Backlit LCD, 1024x600 (WSVGA), 262K Color, 195.07 x 113.4mm Active Area, 500:1 Contrast Ratio, 220 cd/m^2 Brightness, 25ms Response Time
Intel - AC80566UC005DE - CPU - Intel Atom Z510, 1.1GHz, 512KB L2 Cache, 400MHz FSB, 45nm
Battery Pack - Li-Ion Polymer, 7.4V, 3500mAh
Intel - AF82US15W - System Controller Hub - US15W, 400MHz/533MHz FSB
Broadcom - BCM94312HMGB - WLAN / Bluetooth Half Mini PCIe Module Value Line Item - IEEE802.11b/g, Bluetooth V3.0
Elpida - EDE1116AEBG-8E-F - SDRAM - DDR2-800, 1Gb (64Mx16), 1.8V (Qty:4)
Elpida - EDE1116AEBG-8E-F - SDRAM - DDR2-800, 1Gb (64Mx16), 1.8V (Qty:4)
Wus Printed Circuit Co. - 10-Layer - FR4/RCF HDI, 1+8+1, Lead-Free
Touchscreen Overlay - 9', 4-Wire Resistive, PET Film over ITO Glass, w/ Integral Flex PCB
Camera Module Value Line Item - 1.3MP, CMOS, 1/5' Format, Fixed Lens
Kuantech - KSAH1200300T1M3 - AC Adaptor - 12V, 3.0A, w/ 6ft Power Cord and Magnetic Filter
Total BOM Costs $232.88
What Is Not Included in our Cost Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
Manufacturing Notes
Country of Origin / Volume Assumptions
Based on markings, the unit was assembled in China. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in China.
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as LCD display), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.
Design for Manufacturing / Device Complexity
The Archos 9 has an overall component count of 349 (excluding box contents), of which, 109 are mechanical in nature. This accounts for modules such as the display and HDD, Display, and WiFi module as 'single components'. 349-count is inline with other tablets and MIDs we are looking at concurrently with this design.
Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design.
Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.
Design Notes
The Archos 9 is the second device we have seen with the Intel Atom Z5x0 and single-chip integrated System Controller Hub US15W platform. The Atom Z5xx processor with this specific support chip is intended for exactly this type of application, as a MID/PMP, rather than a full-blown netbook. In addition to the Intel chipset there are two MCUs, a 16-bit from Renesas and an 8-bit from Freescale.
Some of the more notable system level components include the 8.9 TFT display from HannStar with LED backlighting, covered with a conventional 4-wire resistive touchscreen overlay, 60GB hard drive from Toshiba, Broadcom WLAN / Bluetooth Mici PCIe module, and, interestingly, has an optical trackpad module, similar to those now being used on recent RIM / Blackberry designs. All of the DRAM is mounted directly on the motherboard in the form of 8 Elpida DDR2 1Gb BGA chips. There is no built-in NAND Flash.
Other silicon-level components include a Chrontel SDTV/HDTV video encoder (CH7317A-BF), a Realtek high-definition audio codec (ALC269Q-GR), and a Genesys Logic PC Camera Controller (GL862).
Here is a summary of the major components of the Archos 9 tablet PC:
Display
- HannStar - HSD089IFW1-A - 8.9' TFT LED Backlit LCD, 1024x600 (WSVGA), 262K Color, 195.07 x 113.4mm Active Area, 500:1 Contrast Ratio, 220 cd/m^2 Brightness, 25ms Response Time
Touchscreen
- 4-Wire Overlay
Motherboard
CPU
- Intel - AC80566UC005DE - Atom Z510, 1.1GHz, 512KB L2 Cache, 400MHz FSB, 45nm
Chipset (Single-Chip)
- System Controller Hub - Intel - AF82US15W - US15W, 400MHz/533MHz FSB
I/O & Interface
- MCU - Renesas - R4F2117RVLP20V - 16-Bit, H8S/2600 CPU Core, CISC, 160KB ROM, 8KB RAM, 20MHz, 112 I/Os
- Video Encoder - Chrontel - CH7317A-BF - SDTV / HDTV, Multiformat
- PC Camera Controller - Genesys Logic - GL862 - USB2.0
- MCU - Freescale - MC9S08QG4CFFE - 8-Bit HCS08 CPU, 20MHz, 4KB Flash, 256B RAM
Memory
- Memory (SDRAM) - Elpida - EDE1116AEBG-8E-F - DDR2-800, 1Gb (64Mx16), 1.8V (x8)
WLAN/Bluetooth
- Broadcom - BCM94312HMGB - Half Mini PCIe Module - IEEE802.11b/g, Bluetooth 3.0
Hard Drive
- Toshiba Storage Device - MK6028GAL - 60GB, PATA, 100MB/s, 1.8', 4200rpm, 2MB Buffer