Mobile Devices

Siemens C65 Mobile Phone Teardown

11 April 2005
The following is an overview of a teardown analysis conducted by IHS Benchmarking.

Main Features

Tri-band GSM candybar-style phone with 1.6-inch 65K color CSTN display, CIF/CMOS camera with digital zoom, 40-note polyphonic ringtones, IrDA and USB connectivity.

Siemens C65 Mobile Phone Main ImageSiemens C65 Mobile Phone Main Image
Marketing / positioning

The C65 appears to be a lower end version of the Siemens CX65 which falls squarely in the midrange of the overall market. Unlike the CX65 with VGA//CMOS camera and 2.1 Inch TFT display, the C65 features a lower end 1.6 Inch CSTN and a CIF camera module. This is a very low-end camera phone aimed at younger, entry-level consumers, does not provide the advanced data storage and transfer capabilities required by more sophisticated users.

As compared to other models within the Siemens product line, the C65 does not stand apart significantly from their other candybar-style phones. The C65 carries over many design elements - and even many specific physical components - from the long line of various A/C/S55/65 models, as well as the CX65 with which it shares near identical internal designs. In other words, where one model may offer a camera while another may not, or Bluetooth vs. non-Bluetooth, the core design elements such as the integrated circuit chipset and the mechanical structures are all very similar, with many identical components.

While such a design approach may offer certain advantages such as improved time-to-market due to design re-use, or brand identity, it may create difficulties in distinguishing the product within the marketplace, or may appear as rather 'stale' as other brands continue to evolve more rapidly.

Siemens C65 Mobile Phone Cost AnalysisSiemens C65 Mobile Phone Cost Analysis

Cost Notes

Main Cost Drivers Representing approximately 67% of total materials costs:

Memory (2 devices - Flash & SDRAM)

DBB & Pwr Mgmt Chips

Display - 1.6-inch CSTN 65K Color / 130x130 -

Camera and Video/Image Processor

RF Transceiver & PA

Subtotal of Cost Drivers

Materials Cost Subtotal

Materials and Manufacturing*

* - The total materials and manufacturing costs reported in this analysis reflect only the direct materials cost (from component vendors and assorted EMS providers), manufacturing and test. Not included in this analysis are costs above and beyond the manufacture of the core device itself - cost of shipping, logistics marketing and other channel costs including not only EMS provider and Siemens' margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device (the phone and packaging, in this case) itself.

Siemens C65 Mobile Phone - Main PCB Back - Shielding RemovedSiemens C65 Mobile Phone - Main PCB Back - Shielding Removed

Manufacturing Notes

While the C65 final assembly location is identified as Germany, we are assuming that the sub-assembly manufacturing - PC assembly and mechanicals fabrication - is performed in a lower-cost, geographically adjacent Eastern European region. We have applied a generalized labor cost assumption that is representative of most Eastern European countries for these manufacturing costs.


As noted above, the C65 shares many design elements with other previous and current Siemens phones - but is virtually identical, at this level, to the recently analyzed Siemens CX65.

Siemens C65 Mobile Phone - Main PCB Front - Shielding RemovedSiemens C65 Mobile Phone - Main PCB Front - Shielding Removed

Main PCB


Power Management

  • DBB - Infineon - PMB8875
    • Integrated single-chip baseband controller/processor.
    • This device not previously seen in other Siemens phones.
    • No data is currently available for this device, and it is assumed that it is new or perhaps a semi-custom ASIC exclusively for Siemens.
    • It is assumed that such integration of the analog and digital functions, along with a compromise in some of the associated functionality, may result in a modest cost savings over a traditional 2-chip solution.
    Memory Display Camera
    • Dialog Semiconductor - D1094DA
      • Siemens uses Dialog Semiconductor products for this purpose extensively, but as with the baseband device the C65 uses a particular IC not previously seen.
      • Intel Strataflash 256 Mb / Hynix SDRAM 64Mb
      • NZ48F4000L0YTQ0 / HY5S6B6DL
      • Siemens continues to avoid the use of single-device MCP memory products, preferring to use 2 separate devices for Flash and RAM. In this case an Intel Strataflash 256Mbit Flash device and a Hynix 64Mbit SDRAM. (Samsung also used as second source in this slot)
      • 1.6 inch diagonal, 130x130 pixel display is relatively commoditized CSTN display - not very noteworthy.
      • CIF/CMOS - Manufacturer Unknown
      • Amazing that Siemens would even bother to downgrade to a CIF resolution camera module, given the extremely competitive environment in the sweet spot of VGA/CMOS modules. They must be giving these away in cereal boxes now, and should be well under the 'average' for VGA/CMOS modules currently.

Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Find Free Electronics Datasheets