Overview / Main Features
The LG Optimus 3D (P920) is a 3G Android 2.2 (Froyo) smartphone with a 4.3 diagonal 800 x 480 TFT display that features parallax barrier 3D (and touchscreen). To make use of the 3D, the LG Optimus 3D also features dual 5MP autofocus cameras for shooting 3D photos and video (with LED 'flash' and a secondary 2MP front facing camera), WiFi, and Bluetooth. The LG Optimus also features a Texas Instruments OMAP processor at it's core - which brings up another interesting point - which is that
At the end of the day the real standout feature is clearly the 3D parallax barrier screen which allows users to view 3D images without special glasses. Still, the 3D bandwagon is, more than likely (along with it's TV counterpart) to be a gimmick that does not stand the test of time - but for the time being, no potential market will go without it's waters being tested. For the moment though - this relegates the EVO 3D to more of a consumer, rather than business-user space.
The LG Optimus features a 4.3" diagonal 'parallax barrier' 3D screen (an LG Display unit), with 800 x 480 pixel resolution. The parallax barrier is a special technology by which the users two eyes see different sets of pixels through a fine polarized filter (achieved with another LCD monochrome layer placed over the underlying TFT - so the effect can be turned on and off) - allowing a 3D image to come from the screen without the need for special glasses - though viewing angle and proximity are critical to getting the full effect. As a side note - this technology differs from the lenticular autostereoscopic technology we recently saw on the Nintendo 3DS. Parallax barrier 3D is also offered by the HTC Evo 3D.
As for the TI OMAP Core processor - that's also an interesting subject. First of all it's worth noting that LG has 3 different Android 2.2 platforms two of which have different dual core chip manufacturers - including Nvidia (Tegra 2), Texas Instruments (OMAP 4), and the third being a single core Qualcomm. LG has really spread their designs thin in this respect - and it makes little sense strategically to have 3 different platforms with 3 different IC manufacturers when they are facing Samsung and Apple who clearly have a tighter strategy that allows them to focus on only one apps processor (and supplier) at a time.
This scattered design and vendor approach may be a question of choosing the best solution for the specific model - because in the case of this model - LG touts a unique approach to improve the performance of the processor (and memory) via what they refer to as a 'tri dual' configuration. Per LG, this architecture features ""a Dual Core, Dual Channel, Dual Memory architecture based on the groundbreaking. TI OMAP4 chipset. This configuration enables users to enjoy significantly improved performance and run-time compared to any other smartphone. Unlike other dual-core smartphones, with single channel and single memory, the LG Optimus 3D enables the simultaneous and thus faster transfer of data between its dual core and dual memory." Which appears to be saying that by splitting the memory and cores into two discrete channels - performance for multitasking (or running simulataneous stereo images) should be improved - though CNET's review says they ""did see more lag than we'd have liked". The best laid plans….
The dual 5MP cameras for taking 3D photos and videos are interesting - and again the HTC Evo offers the same (Dual & 5MP) feature. This is key, given, as LG themselves admit in their press release ""The LG Optimus addesses the lack of 3D content issue….(with) a dual-lens camera for 3D recording".
General Consumers - Less business user-oriented
Announced February 2011 - Hardware released July 2011
Pricing - Based on a cursory internet search, it appears the LG Optimus P920 currently sells from ~$550 USD to ~$700 USD unlocked with no subsidy or user contract.
Availability - Worldwide
For the purposes of this teardown analysis, we have applied a lifetime production volume of approximately 500K units.
As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.
Main Cost Drivers ~ 73% of Total Materials Cost
LG Display - LH430WV2-SD01_V02 - Display Module - 4.3' Diagonal, 16.7M Color TFT LCD, 480 x 800 Pixels, w/ Parallax Barrier 3D
Primary Camera Assembly - Contains 2 x 5MP Auto Focus Camera Modules
Synaptics - Touchscreen Assembly - 4.3' Diagonal, Capacitive, Glass/Glass Overlay, Painted
Texas Instruments - OMAP4430DCBS - Application Processor - TI OMAP4, Dual-Core ARM Cortex-A9, 1GHz, IVA 3 Hardware Accelerator, SGX540 3D Graphic Core, 1080P 2D, 720P 3D, 45nm Process, PoP
SanDisk - SDIN5C2-8G - Flash - iNAND, 8GB
Samsung Semiconductor - K3PE4E400M-XGC1 - SDRAM - Mobile DDR2, 4Gb, PoP
Intel - PMB9811 - Baseband / Power Management - Quad-Band GSM/EDGE, WCDMA/HSPA+, ARM Core, 40nm
LG Innotek -10-Layer - FR4/RCF HDI, Stacked Via, Lead-Free, Halogen-Free
Intel - PMB5712 - RF Transceiver - Quad-Band GSM/EDGE, WCDMA/HSPA+
Direct Materials + Manufacturing $195.58
What Is Not Included in our Cost Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and in some circumstances the packaging and literature as well.
Country of Origin / Volume Assumptions
Based on device markings, we've based our analysis with the final assembly in Korea. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in Korea.
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as wall power charger), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. ""Auto" inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.
Design for Manufacturing / Device Complexity
The LG Optimus P920 LTE handset has an overall component count of 870 (excluding box contents) This is inline with other current smartphones - and does not strike us as particularly complex to manufacture.
Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design.
Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.
The largest part of the BOM budget in tablets and many smartphones is the combined display with touchscreen overlay, and the LG Optimus only goes deeper in this direction with the core user feature being the 3D display. Display and touchscreen have become the entire interface for smartphones in the 'post iPhone' world - so it makes sense that so much attention and budget go into what essentially IS pretty much the whole user interface. LG is second to Samsung in terms of their vertical integration and their ability to supply themselves with key core components such as the display from LG Display (LH430WV2-SD01_V02)- Parallax Barrier 3D, 4.3' Diagonal, 16.7M Color TFT, 800 x 480 Pixels. The touchscreen is from Synaptics - and is a capacitive glass type. Furthermore, because of Synaptics strategy we know that when we see a Synaptics control chip (T1320) - the whole turnkey touch solution is from Synaptics.
The LG Optimus is a two sphere design internally - with one sphere revolving around the Texas Instruments OMAP4430 apps processor, and the other sphere being the baseband and power management (wireless interface) section which has the Intel (Infineon) PMB9811 'XGold 626' at it's core (which is complemented by an Intel (Infineon) PMB5712 power management IC. Perhaps as a result of the TI OMAP core - there's a lot of other TI chip content including Power management chips, Audio Codec, HDMI companion chips and more.
Otherwise in the memory department there is both a discrete 4Gb DDR2 DRAM and an MCP, not to mention 8GB of on-board NAND Flash.
Bluetooth and WiFi are supported by the single Texas Instruments WL1271 chip - which competes with the super popular Broadcom solution, but Broadcom still makes it to the party in the GPS receiver slot (BCM4751).
Here is a summary of the major components used in the LG Optimus design:
Display / Touchscreen Module
- LG Display - LH430WV2-SD01_V02 - Parallax Barrier 3D, 4.3' Diagonal, 16.7M Color TFT, 800 x 480 Pixels
- Synaptics - Touchscreen Assembly - 4.3' Diagonal, Capacitive, Glass Overlay, Painted
- Application Processor - Texas Instruments - OMAP4430DCBS - TI OMAP4, Dual-Core ARM Cortex-A9, 1GHz, IVA 3 Hardware Accelerator, SGX540 3D Graphic Core, 1080P 2D, 720P 3D, 45nm Process, PoP
Baseband / Power Management
- Baseband / Power Management - Intel - PMB9811 - Quad-Band GSM/EDGE, WCDMA/HSPA+, ARM Core, 40nm
- Power Management IC - Texas Instruments - PTWL6030B1 - w/ USB OTG Module and Switch Mode Battery Charger
- DRAM - Samsung Semiconductor - K3PE4E400M-XGC1 - Mobile DDR2, 4Gb, 1.2V, 46nm, PoP
- NAND Flash - SanDisk - SDIN5C2-8G - iNAND, 8GB
- MCP - Hynix - H8BCS0QG0MMR-46M
- RF Transceiver - Intel - PMB5712 - Quad-Band GSM/EDGE, WCDMA/HSPA+
- Transmit Module - RF Micro Device - RF6260 - Multimode, Multiband GSM/EDGE/UMTS/HSPA+/LTE
BT / FM / GPS / WLAN
- Bluetooth / WLAN / FM Transmitter/Receiver - Texas Instruments - WL1271B - Single Chip, IEEE802.11b/g/n…
- GPS Receiver - Broadcom - BCM4751IUB2G - Single Chip, 65nm
User Interface (and Sensors)
- Audio Codec - Texas Instruments - PTWL6040A1 - 8-Channel
- HDMI Connector Companion IC - Texas Instruments - TPD12S015YFFR - HDMI 1.3, w/ Integrated DC-DC Regulator, I2C Level Shifter and ESD Protection
- Gyroscope - Invensense - MPU-3050 - 3-Axis, 16-Bit Digital Output, w/ Integrated Digital Motion Processor, & Temperature Sensor
- eCompass - Aichi Steel - AMI306 - 3-Axis, 3 Magneto-Impedance Sensor Elements, w/ Built-In ADC, Amplifier, Temperature Sensor, 12-Bit Digital Output
- Accelerometer & Inclinometer - Kionix - KXTF9 Series - 3-Axis, +-2g/4g/8g, 8-Bit/12-Bit Digital Output
- Primary Cameras (x2) - 5.0MP, CMOS, 1/3' Format, Auto Focus Lens
- Secondary Camera - 2.0MP, CMOS, 1/10' Format, Fixed Lens