Overview / Main Features
The Dell Venue Pro is Dell's first Microsoft Windows Phone 7 (WP7) device that features a 4.1- inch AMOLED screen as well as a vertical QWERTY slider keypad. The Venue Pro is a significant product from Dell as it is only one of 4 OEM brands that debut devices running on Microsoft's flagship platform during WP7's introduction in October of 2010. Microsoft's Windows Phone 7 represents a completely new OS design and a fresh take on user interface designed to compete more effectively with offerings from rival Apple and Google.
As with all other WP7 handsets, device makers has to met a specific minimum hardware such as a 480 x 800 pixel display, capacitive touchscreen and 5MP resolution camera. However, even more fundamental to those requirements, there appears to be a common thread of component commonality that is universal to all of the 10 first generation WP7 handsets: Qualcomm's Snapdragon QSD8x50 series chipset.
Overall, the Dell Venue Pro is a tri-band UMTS / quad-band GSM smartphone that is designed with a physical keypad geared more towards the enterprise setting. This specific model of the Venue Pro comes configured with 8GB of storage via microSD.
High end smartphones
Pricing - The Dell Venue Pro sells directly through Dell.com for $449 or $99 with a wireless contract. This reference price point is significantly less than other premium smartphones in this category that regularly sells for over $550 and typically a $199 subsidized price.
Availability - T-Mobile Network / North America
For the purposes of this teardown analysis, we have applied a lifetime production volume of approximately 250,000 units.
As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.
Main Cost Drivers ~85% of Total Materials Cost
Samsung Mobile Display - AMS410GJ02-0 - Display Module Value Line Item - 4.1' Diagonal, 16.7M Color AMOLED, 480 x 800 Pixels
Qualcomm - QSD8250 - Baseband Processor - Quad-Band GSM/GPRS/EDGE, UMTS HSPA, 1GHz CPU, 600MHz DSP, WiFi, Bluetooth, gpsOne, 3D Graphics, Mobile Broadcast TV, 65nm
Touchscreen Assembly / Display Window - 4.1' Diagonal, Capacitive, Glass Overlay, Painted, Printed, Contains Atmel mXT224 Touch Controller
Hynix - H8BFS0WU0MCR-4EM - MCP - 8Gb NAND Flash + 4Gb Mobile DDR
Camera Assembly Value Line Item - 5.0MP, CMOS, 1/4' Format, Auto Focus Lens, BSI Technology
SanDisk - MicroSD Memory Card - 8GB
Compeq - 10-Layer - FR4/RCF HDI, 3+4+3, Lead-Free
Azurewave - AW-NH620A - Bluetooth / FM / WLAN - Contains Broadcom BCM4329 Die, IEEE 802.11a/b/g/n, Bluetooth V2.1+EDR, 65nm
Cheng Uei Precision Industry - Battery - Li-ion, 3.7V, 1400mAh
Sliding Mechanism - Insert-Molded, Stamped / Formed Metal, 10-Pieces, 7 Metal Tabs, Spot-Welded, Injection Molded Plastic, Painted, w/ Integral Spring-Loaded Detent Mechanism & Multiple Metal Inserts
Qualcomm - PM7540 - Power Management IC - w/ Integrated USB Transceiver
Qualcomm - RTR6285 - RF Transceiver - ZIF, Quad-Band GSM/EDGE, Tri-Band UMTS/HSPA Transceiver w/ Rx Diversity, Integrated GPS Receiver, 0.18um RF CMOS
0005ADUUS - Wall to USB Charger - 5V, 1A
Handsfree Accessory - Stereo, Earphone / Microphone, 3.5mm Plug, w/ Single Control Button
Texas Instruments - TPS65023RSB - Power Management IC - 3 Step-Down DC-DC Converters, 2 x 200mA LDOs, I2C Interface
2-Layer - Flex Kapton, Lead-Free, w/ Stiffeners
Direct Materials + Manufacturing $183.86
What Is Not Included in our Cost Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
OEM/ODM/EMS Relationships / Manufacturing
Dell mobility products follow a purely out-sourced model - even for designs. For mobile handsets, Dell uses Qsida (formerly BenQ) for both design and manufacturing. We have previously seen this ODM/EMS provider in earlier designs such as the Dell Streak and Aero which share common components.
Country of Origin / Volume Assumptions
Based on device markings, we made the assumption that the unit was assembled in China. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in China.
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as the display module), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.
Design for Manufacturing / Device Complexity
The Dell Venue Pro handset under analysis here has an overall component count of 1109 (excluding box contents), of which, 832 reside on the main PCB. This complexity level is at the upper extremes of what we typically see from smartphone device makers.
Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.
Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.
The core of the Dell Venue Pro design revolves around the Qualcomm QSD8250 chipset as well as the accompanying PM7450 power management chip and RTR6285 RF transceiver. We have seen this common reference design many times prior starting with the Toshiba TG01 (Windows Mobile 6 smartphone) in late 2009 and continuing throughout the many integrations of Android handsets so therefore, we understand this Qualcomm platform to be quite mature.
However, as with most modern smartphones in the post-iPhone era; the major areas of product differentiation on the Dell Venue Pro is in the components that contribute to the overall look, feel and function of the device; namely components that make up the holistic user experience. Here, Dell invested heavily in the quality of the display and user input. The selection of a 4.1 inch AMOLED is significant as there are limited sources for this premium display. Unsurprisingly, we see that Samsung is the key manufacturer for the AMOLED. [Samsung is also another WP7 handset provider that differentiates with their Super AMOLED display technology.] Also, as with most premium smartphones, the Dell Venue Pro comes replete with sensors such as 3-axis accelerometer, ambient sensors and GPS. Of course, both WiFi and Bluetooth wireless connectivity comes standard.
In the memory function, the Dell Venue Pro primarily uses the integrated memory multi-package chip (MCP) with 8Gb (1GB) of NAND flash and 4Gb of mobile DDR (512MB) that runs alongside the Qualcomm QSD8250. Due to the architecture of WP7 memory extension [of the integrated 1GB memory] is provided through external 8GB microSD module - however, this memory is not user accessible and not considered removable or hot-swappable [as with other OSes like Android or Symbian].
Here is a summary of the major components used in the Dell Venue Pro design:
Display / Touchscreen
- Display Module - Samsung Mobile Display - AMS410GJ02-0, 4.1' Diagonal, 16.7M Color AMOLED, 480 x 800 Pixels
- Touchscreen Assembly / Display Window - 4.1' Diagonal, Capacitive, Glass Overlay, Painted, Printed, Contains Atmel mXT224 Touch Controller
Apps / Baseband Processing
- Baseband Processor - Qualcomm- QSD8250, Quad-Band GSM/GPRS/EDGE, UMTS HSPA, 1GHz CPU, 600MHz DSP, WiFi, Bluetooth, gpsOne, 3D Graphics, Mobile Broadcast TV, 65nm
- MCP - Hynix - H8BFS0WU0MCR-4EM, 8Gb NAND Flash + 4Gb Mobile DDR
- MicroSD Memory Card - SanDisk, 8GB
BT / FM / GPS / WLAN
- Bluetooth / FM / WLAN - Azurewave - AW-NH620A, Contains Broadcom BCM4329 Die, IEEE 802.11a/b/g/n, Bluetooth V2.1+EDR, 65nm
- Power Management IC - Qualcomm - PM7540
- Power Management IC - Texas Instruments - TPS65023RSB, 3 Step-Down DC-DC Converters, 2 x 200mA LDOs, I2C Interface
- Battery Fuel Gauge - Texas Instruments - bq27500DRZ, System-Side, Single Lithium Cell
RF / PA
- RF Transceiver - Qualcomm - RTR6285, Quad-Band GSM/EDGE, Tri-Band UMTS/HSPA Transceiver w/ Rx Diversity, Integrated GPS Receiver, 0.18um RF CMOS
- FEM - Murata, Quad-Band GSM & Tri-Band WCDMA Antenna Switch, Quad-Band GSM Rx RF SAW Filters
- PAM - TriQuint Semiconductor - TQM7M5012H, Quad-Band GSM/GPRS/EDGE
- Electronic Compass - Yamaha - YAS529-PZ, 3-Axis, SPI / I2C Interface, w/ Built-In ADC, Amplifier, Clock Generator
- Accelerometer - Bosch Sensortec - BMA150, MEMS 3-Axis, +-2g/4g/8g, Switchable via SPI & I2C Interfaces