SonyEricsson W760i Mobile Phone Teardown

Overview / Main Features

The W760i is a full-featured "Walkman music phone model from Sony Ericsson which also features integrated GPS and mobile gaming functionalities. Tagged as the ""first truly global Walkman" handset, the tri-band UMTS/HSPDA (850/1900/2100MHz) and quad-band GSM/EDGE slider phone is only one of a handful of Sony Ericsson models that can be used across the globe.

Internally, the W760i shares many of the major components (such as DBB & PAM) as the previously analyzed premium ""Cybershot" C902 model. The W760i has considerably less user-accessible memory as well as a lower resolution image senor slotting the device - in terms of cost - as a mid-tier handset offering.

Rounding out the music phone package, the W760i has a built in FM tuner, 2.2" primary display with 240 x 320 resolution, accelerometer for motion sensing inputs, memory expansion via Memory Stick Micro removable media and a host of value added software such as Google Maps, Wayfinder Navigator and various game titles.

SonyEricsson W760i Mobile Phone Main Image

Mainstream mobile phone consumers with an orientation towards music functionalities

Released

Per press releases, first announced in CES 2008 and subsequently released Q2 2008.

Availability

- The SonyEricsson W760 is currently available to network providers in select world markets such as Europe and Asia. However, since the W760 have 'global' network capabilities, it will likely be made available in more diverse markets.

SonyEricsson W760i Mobile Phone - Main PCB Top

Volume Estimations

For the purposes of this teardown analysis, we have assumed a lifetime production volume of 2M units.

As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed, volumes increment by an order of magnitude. Minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis.

iSuppli's Design Forecast Tool (DFT) and Market Shares

As part of iSuppli's Design Forecast Tool (DFT), we forecast handset shipments by major design feature and manufacture, as well as the number of design starts a manufacturer will have by feature set.

iSuppli estimates unit shipments of 168 million HSDPA handsets in 2008 global market. We further estimate 111 million units of 3 megapixel camera phones to ship in the 2008 global market. All estimates are based on a 2 year product life span assumption with an overall global market share of 9% for SonyEricsson.

Main Cost Drivers Representing ~72% of total material cost

ST Microelectronics - DB3150 - DBB - Digital Baseband Processor, PoP

Display Module Value Line Item - 2.2' Diagonal, 262K Color TFT, 240 x 320 Pixels

Camera Module Value Line Item - 3.1MP, 1/4' Format, Auto Focus Lens

Samsung Semiconductor - KAL00T00MM-AJ55 - MCP - 1Gb NAND Flash + 512Mb Mobile SDRAM, PoP

Dialog Semiconductor - D1565CC - ABB - Analog Baseband / Power Management

Battery - Li-Ion Polymer, 3.6V, 930mAh

Sony - Memory Stick Micro (M2) Memory Card - 1GB

ST Microelectronics - STLC2592 - Bluetooth / FM Radio - Single Chip, V2.1+EDR, w/ FM Radio Receiver

2 Layer - Flex Kapton, w/ Metal Stiffeners

NXP Semiconductors - RF3000 - RF Transceiver - ZIF, Quad-Band GSM/EDGE

Infineon - PMB2525 - GPS Receiver - Single Chip, A-GPS, for 2.5G and 3G Networks, 0.13um, w/ Integrated Front-End RF, PLL, PM, Correlator Engine, & Host Control Interface

Epcos - B30674D2024R424 - FEM - Quad-Band GSM, Tri-Band UMTS Antenna Switch, & SAW Filters

Infineon - PMB5701 - RF Transceiver - Tri-Band, UMTS / WCDMA, HSDPA / HSUPA

Salcomp - CST-70 - Charger - 4.9V, 700mA

Unitech - 8-Layer - FR4/RCF HDI, 2+4+2, Lead-Free, Halogen-Free

Skyworks - SKY77329-15 - PAM - Quad-Band GSM/GPRS/EDGE, Supports for Class 12 GPRS Multi-Slot Operation

Keypad Assembly - Injection Molded Plastic Keys, Chromed, Silicone Rubber Substrate

ST Microelectronics - LIS331DLTR - Accelerometer - MEMS 3-Axis, ±2g/±8g, Digital Output

2-Layer - Flex Kapton, w/ Metal Stiffeners

High Intensity White - Right Angle (Qty:8)

Enclosure, Main, Top - Stamped / Formed Metal, w/ 1 Rivet, 10 Inserts, 1 Spot-Welded Metal Plate

Enclosure, Display, Bottom - Die-Cast Magnesium, Painted

2-Layer - Flex Kapton, w/ Stiffeners3-Layer - Rigid/Flex Hybrid, FR4/Kapton 2+1, Lead-Free

Loudspeaker - Ringer, Mylar Cone (Qty:2)

National Semiconductor - LM3208TL - Regulator - DC-DC Converter, Step-Down, Adjustable, 650mA

Material and Manufacturing $92.95

SonyEricsson W760i Mobile Phone Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

OEM/ODM/EMS Relationships / Manufacturing

Per iSuppli's ""Global OEM Manufacturing and Design Analysis (GOMDA) - Mobile Handsets Q1 2008", we estimate that SonyEricsson outsources approximately 65% of its production to EMS providers such as Flextronics and Foxconn, as well as ODMs like Arima and Chi Mei Communications.

SonyEricsson W760i Mobile Phone - Main PCB Bottom

Country of Origin / Volume Assumptions

Based on markings, the unit was assembled in Malaysia. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in Malaysia.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as the display module), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. ""Auto" inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

SonyEricsson W760i Mobile Phone - Enclosure Disassembly

Design for Manufacturing / Device Complexity

The Sony Ericsson W760 has a component count of 896 (excluding box contents), of which, 183 are mechanical in nature. The W760 represent our highest device complexity within the competitive set of 5 music handsets in this analysis. Justifiable, the W760 is a slider with a lot more features than others. For example, since the W760 is a global handset, it carries the burden of additional power amplifiers to address the various UMTS frequencies (not to mention the addition of an integrated GPS and accelerometer). Also, the W760 features largest number of passive components at well over 600 parts.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for Malaysia.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Design Notes

As with previously analyzed HSDPA-capable Sony Ericsson handsets, the W760 features a ST Micro DBB solution with Dialog ABB and Skyworks PAMs.

Here is a summary of the major components used in the SonyEricsson W760 design:

Main PCB

Digital Baseband / Memory

• DBB (Digital Baseband Processor) - ST Microelectronics - DB3150
• 1Gb NAND & 512Bb Mobile SDRAM (MCP) - KAL00T00MM-AJ55 - Samsung Semiconductor

Analog Baseband / Power Management

• ABB (Analog Baseband / Power Management) - Dialog Semiconductor - D1565CC

User Interface

• Bluetooth / FM Radio - ST Microelectronics - STLC2592
• USB On-the-Go Transceiver - NXP Semiconductors - ISP1508AET
• Accelerometer - ST Microelectronics - LIS331DLTR

RF Transceiver

• UMTS / WCDMA, HSDPA / HSUPA RF Transceiver - Infineon - PMB5701
• Quad-Band GSM/EDGE RF Transceiver - NXP Semiconductors- RF3000

Power Amplifier

• Quad-Band, GSM850/900/DCS1800/PCS1900 MHz PAM - Skyworks - SKY77329-15
• Single-Band, WCDMA 1900 MHz PAM - Skyworks - SKY77174-14
• Dual-Band, WCDMA 850/2100 MHz PAM - Skyworks - SKY77175-3

GPS

• GPS Receiver - Infineon - PMB2525

Display

• 2.2' Diagonal, 262K Color TFT, 240 x 320 Pixels

Camera

• 3.1MP, 1/4' Format, Auto Focus Lens

"

SonyEricsson W760i Mobile Phone - Box Contents