Mobile Devices

SonyEricsson Z750a Mobile Phone Teardown

17 July 2008
The following is an overview of a teardown analysis conducted by IHS Benchmarking.


The SonyEricsson Z750a is a 3.5G, HSDPA (1.8Mbps) WCDMA clamshell handset that is quad-band GSM and tri-band UMTS. The Z750a also features GPS, a 2MP fixed lens camera, Bluetooth 2.1 and FM Radio.

SonyEricsson Z750a Mobile Phone Main ImageSonyEricsson Z750a Mobile Phone Main Image
Target Market

Mainstream users with focus on internet / high-speed data users interested in the high speed HSDPA capabilities. Now that HSDPA is becoming more and more common, and although this phone has a fairly full contingent of features, it seems this phone is still just the high end of the mid-range, and not really a 'high-end' phone.

Release / Availability

March, 2008.

Pricing / Availability

Per SonyEricsson - "The Sony Ericsson Z750a will be available at AT&T stores and authorized dealers in early April for $49.99 after a $100 mail-in-rebate and new two-year service contract.

Volume Estimations

For the purposes of this teardown analysis, we have assumed a lifetime production volume of 2.03 Million units.

As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

SonyEricsson Z750a Mobile Phone - Main PCB BottomSonyEricsson Z750a Mobile Phone - Main PCB Bottom
ISuppli's Design Forecast Tool (DFT) and Market Shares

As part of iSuppli's Design Forecast Tool (DFT), we forecast handset shipments by major design feature and manufacture, as well as the number of design starts a manufacturer will have by feature set.

From our Design Forecast Tool (DFT), we estimate unit shipments of 168 million HSDPA handsets in the 2008 global market, furthermore we estimate 289 million 2Mpx camera phone units to ship in the 2008 global market.

SonyEricsson Z750a Mobile Phone Cost AnalysisSonyEricsson Z750a Mobile Phone Cost Analysis
Cost Notes

Major Cost Drivers (Representing ~65% of total direct materials costs)

ST Microelectronics - DB3150 - DBB - Digital Baseband Processor, PoP

Primary Display Module Value Line Item - 2.2' Diagonal, 262K Color TFT LCD, 240 x 320 pixels

Camera Module Value Line Item - 2MP CMOS, 1/4' Format, Fixed Lens

Samsung Semiconductor - K5D1G12ACA-D090 - MCP - 1Gb NAND Flash + 512Mb DRAM, PoP

Dialog Semiconductor - D1565CC - ABB - Analog Baseband / Power Management

SonyEricsson - BST-33 - Battery - Li-Polymer, 3.6V, 950mAh

Infineon - PMB2525 - GPS Receiver - Single Chip, 0.13um, w/ Integrated Front-End RF, PLL, PM, Correlator Engine, & Host Control Interface

High Intensity White (Qty:14)

Unitech - 8-Layer - FR4/RCF HDI, 2+4+2, Lead-Free, Halogen-Free

Secondary Display Module Value Line Item - 1.1' Diagonal, Monochrome, 36 x 128 Pixels

NXP Semicoductors - RF3000 - RF Transceiver - Quad-Band GSM/EDGE, ZIF

ST Microelectronics - STLC2592 - Bluetooth / FM Radio - Single Chip, V2.1+EDR, w/ FM Radio Receiver

Infineon - PMB5701 - RF Transceiver - Tri-Band, UMTS / WCDMA, HSDPA / HSUPA

Emerson Network Power - Charger - 4.9V, 700mA

Skyworks - SKY77329-15 - PAM - Quad-Band, GSM850/900/DCS1800/PCS1900, Supports for Class 12 GPRS Multi-Slot Operation

Materials & Manufacturing $92.26

What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

SonyEricsson Relationships / Manufacturing

Per iSuppli's ""Global OEM Manufacturing and Design Analysis (GOMDA)", we estimate that SonyEricsson outsources approximately two-thrids of it's production to EMS providers such as Flextronics and Foxconn, as well as ODMs like Arima and Compal.

Country of Origin / Volume Assumptions

Based on markings, the unit was assembled in Malaysia. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were all domestically sourced in Malaysia.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as Bluetooth modules), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. ""Auto" inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

SonyEricsson Z750a Mobile Phone - Enclosure DisassemblySonyEricsson Z750a Mobile Phone - Enclosure Disassembly

Design for Manufacturing / Device Complexity

The Z750a has a total component count (less box contents) of 791 components (not including box contents), of which 115 are mechanical in nature - this seems well within the norms for a phone with this type of feature set.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Design Notes

The Z750a design is different from all other SonyEricsson phones previously analyzed by iSuppli in that this is the first HSDPA SonyEricsson we have analyzed, and only the second non-Qualcomm-based HSDPA phone (the vast majority seen have all been based on Qualcomm MSM6275, 6280 and 7200 chipsets). Only the Nokia N95 also featured a non-Qualcomm () solution. The DBB itself is large and with a very high pincount (440) when compared to GSM/EDGE devices previously analyzed from SonyEricsson. Furthermore, all of the SonyEricsson phones analyzed to date use a TI chipset solution, here they are using an ST Microelectronics core HSDPA solution (DB3150). Not only is this a first that we see an ST Micro DBB solution in a SonyEricsson, but the first ST Micro DBB solution ever seen - and it's HSDPA. Furthermore, like so many applications processors in new designs (this chip probably serves a bit of double-duty in this sense), this DBB also features stacked, 'Package on Package' memory.

The Analog Baseband device is from Dialog Semiconductor, seen a few times previously in SonyEricsson models, but mostly (in the past now) in Siemens designs of yesteryear.

Main PCB

Digital Baseband / Memory

DBB - ST Microelectronics - DBB - Digital Baseband Processor, PoP

MCP - Samsung Semiconductor - K5D1G12ACA-D090 - MCP - 1Gb NAND Flash + 512Mb DRAM, PoP

Analog Baseband / Power Management

Power Management - Dialog Semiconductor - D1565CC - ABB - Analog Baseband / Power Management

RF Transceiver

RF Transceiver (GSM) - NXP - RF3000 - Quad-Band GSM/EDGE

RF Transceiever (WCDMA) - Infineon - PMB5701 - Multi-Band, UMTS / WCDMA, HSDPA / HSUPA

Power Amplifiers (PAM)

PAM (GSM) - Skyworks - SKY77329-15 - Quad-Band, GSM850/900/DCS1800/PCS1900, Supports for Class 12 GPRS Multi-Slot Operation

PAM (WCDMA) - Skyworks - SKY77175-3 - Dual-Band, WCDMA 850/2100 MHz

PAM (WCDMA) - Skyworks - SKY77174-14 - Single-Band, WCDMA 1900

User Interface

Bluetooth / FM Radio - ST Microelectronics - STLC2592 - Single Chip, V2.1+EDR, w/ FM Radio Receiver


GPS Receiver - Infineon - PMB2525 - Single Chip, 0.13um, w/ Integrated Front-End RF, PLL, PM, Correlator Engine, & Host Control Interface


Primary - 2.2' Diagonal, 262K Color TFT, 240 x 320 Pixels

Secondary - 1.1' Diagonal, Monochrome OLED, 36 x 128 Pixels

Camera Module

Primary - 2.0MP, CMOS, 1/4' Format, Fixed Lens

SonyEricsson Z750a Mobile Phone - Box ContentsSonyEricsson Z750a Mobile Phone - Box Contents

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