Mobile Devices

SonyEricsson K530i Mobile Phone Teardown

20 May 2008
The following is an overview of a teardown analysis conducted by IHS Benchmarking.

Overview

The SonyEricsson K530i is a mid-range phone from SonyEricsson (as are other 500 series phones). This model is a mid-range to (even) entry-level 3G (UMTS) candybar phone with a basic feature-set - though it features the same electronic architecture as higher end phones from SonyEricsson (the applications processor specifically from the P1, W950i and several other SonyEricsson phones.

SonyEricsson K530i Mobile Phone Main ImageSonyEricsson K530i Mobile Phone Main Image
Target Market

Mainstream users. This is a mid-market 3G phone.

Release / Availability

Q2, 2007.

Pricing / Availability

Available online at the time of writing (unlocked) for approximately $180 USD.

Volume Estimations

For the purposes of this teardown analysis, we have assumed a lifetime production volume of 1.9 M units.

As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

SonyEricsson K530i Mobile Phone - Main PCB TopSonyEricsson K530i Mobile Phone - Main PCB Top

ISuppli's Design Forecast Tool (DFT) and Market Shares

As part of iSuppli's Design Forecast Tool (DFT), we forecast handset shipments by major design feature and manufacture, as well as the number of design starts a manufacturer will have by feature set.

From our Design Forecast Tool (DFT), we estimate unit shipments of 116 million units of WCDMA handsets in the 2008 global market. We further estimate unit shipments of 289 million 2Mpx camera phones in the 2008 global market.

SonyEricsson K530i Mobile Phone Cost AnalysisSonyEricsson K530i Mobile Phone Cost Analysis
Cost Notes

Main Cost Drivers

Intel - xx5060M0Y0B0 - MCP - 512Mb NOR Flash, 128Mb PSRAM - Qty(1)

Texas Instruments - D751980CIZ - DBB - Applications Processor - Qty(1)

Display Module - 2.0' Diagonal, 262K Color TFT, 176 x 220 Pixels - Qty(1)

Texas Instruments - D761761B2Z - DBB - Digital Baseband Processor - Qty(1)

Primary Camera Module - 2.0MP CMOS, 1/4' Format - Qty(1)

Sony Ericsson - BST-33 - Battery - Li-Ion Polymer - 3.6V, 950mAh - Qty(1)

ST Microelectronics - STLC2590 - Bluetooth / FM Radio - Single Chip - V2.0+EDR, w/ FM Radio Receiver- Qty(1)

NXP - RF2101 - RF Transmitter - WCDMA - Qty(1)

Skyworks - SKY77334-12 - PAM - Tri-Band, GSM900/DCS1800/PCS1900 - Qty(1)

NXP - RF2111 - RF Receiver - WCDMA - Qty(1)

Antenna Switch Module - Contains Antenna Switch & 2 RF Pin Diodes - Qty(1)

NXP - RF2001 - RF Transceiver - ZIF, Tri-band, GSM - Qty(1)

Total w/ Manufacturing $77.77

What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

SonyEricsson K530i Mobile Phone - Main PCB BottomSonyEricsson K530i Mobile Phone - Main PCB Bottom

Manufacturing Notes

SonyEricsson Relationships / Manufacturing

Per iSuppli's "Global OEM Manufacturing and Design Analysis (GOMDA), we estimate that SonyEricsson outsources approximately two-thrids of it's production to EMS providers such as Flextronics and Foxconn, as well as ODMs like Arima and Compal.

Country of Origin / Volume Assumptions

Based on markings, the unit was assembled in China. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were all domestically sourced in China.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as Bluetooth modules), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. ""Auto" inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

SonyEricsson K530i Mobile Phone - Enclosure DisassemblySonyEricsson K530i Mobile Phone - Enclosure Disassembly

Design for Manufacturing / Device Complexity

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Design Notes

The K530i design shares much in common with many previously analyzed SonyEricsson models and demonstrates SonyEricsson's commitment to leveraging common parts across multiple models. The k530i design is based on a core Texas Instruments DBB (D761761B2Z - common to 3 other models seen back in 2006), and a TI applications processor (D751980CIZ - also seen in the recently analyzed high-end P1i). As is also often the case in previously analyzed SonyEricsson models, the analog baseband / power management portion is handled by the TI TWL93016FZQW such as those found in 7 other SonyEricsson handsets we have analyzed. The RF section is handled by 3 discrete NXP chips (RF2001 - RF Transceiver - GSM, RF2101 - RF Transmitter - WCDMA, RF211 - Receiver - WCDMA), and two Skyworks PAMs (SKY77334-12 (GSM) and SKY77412-16 (WCDMA)).

One interesting note - despite most of the phones seen this quarter, and a general trend away from both NOR Flash and SRAM/pSRAM, this phone features a more traditional MSP from Intel with 512Mb NOR and 128Mb pSRAM.

Main PCB

Baseband

DBB - Digital Baseband - Texas Instruments - D761761B2Z

DBB - Applications Processor - Texas Instruments - D751980CIZ

Analog Baseband / Power Management

Texas Instruments - TWL93016FZQW

Memory

MCP - Intel - xx5060M0Y0B0 - 512Mb NOR Flash, 128Mb PSRAM

RF

RF Transmitter - WCDMA - NXP - RF2101

RF Receiver - WCDMA - NXP - RF2111

RF Transceiver - NXP - RF2001

Power Amplifiers (PAM)

PAM (GSM) - Skyworks - SKY77334-12

PAM - WCDMA - Skyworks - SKY77412-16

User Interface

Bluetooth / FM Radio - ST Microelectronics - STLC2590

Display

2.0' Diagonal, 262K Color TFT, 176 x 220 Pixels

Camera Module

Primary - 2.0MP, CMOS, 1/4' Format, Fixed Lens

Secondary - SGA CMOS, 400 x 400 Pixels, 1/9' Format, Fixed Lens

"

SonyEricsson K530i Mobile Phone - Box ContentsSonyEricsson K530i Mobile Phone - Box Contents



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