Acquired Electronics360

Mobile Devices

LG KP151q Mobile Phone Teardown

14 August 2009
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

Overview / Main Features

The LG KP151q is a low cost quad-band GSM/GPRS handset developed and marketed to emerging markets. In this case, the ruby red flip phone appears only to be exclusive to the Brazilian market. Overall, the 2.5G handset features a 1.5 inch CSTN display with 65,000 colors, VGA resolution camera and FM radio.

LG KP151q Mobile Phone Main ImageLG KP151q Mobile Phone Main Image

Target Market

Emerging markets



Pricing and Availability

Pricing - Mobile handset pricing typically has little bearing on the true market value of the device due to the fact that service carrier invariably use subsidies to incentivize consumers to commit to long term service contracts.

Availability - Brazil

Volume Estimations

For the purposes of this teardown analysis, we have assumed a lifetime production volume of 2M units.

As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

LG KP151q Mobile Phone - Main PCB BottomLG KP151q Mobile Phone - Main PCB Bottom

Cost Notes

Main Cost Drivers Representing ~70% of total materials cost

Texas Instruments - D659IBQA - DBB / RF Transceiver - Single-Chip, Quad-Band GSM/GPRS, TI LoCosto

Giantplus - GPM693F0 - Display Module Value Line Item - 1.5' Diagonal, 65K CSTN, 128 x 128 Pixels

Battery - Li-Ion, 3.7V, 800mAh

Spansion - S71NS128PC0ZJETV - MCP - 128Mb NOR Flash + 64Mb PSRAM, 90nm Process

Camera Module Value Line Item - VGA, CMOS, Fixed Lens

Texas Instruments - TWL3031FZPH - ABB - Analog Baseband / Power Management, TI LoCosto

Salcomp - Charger - 5.6V, 400mA, 1.5m Cord, w/ Clear Plastic Bag Packaging

LG Innotek - 6-Layer - FR4/RCF HDI, 1+4+1

Handsfree Accessory - Stereo, Earphone / Microphone, w/ Single Control Button, w/ Clear Plastic Bag Packaging

Skyworks - SKY77318-12 - PAM - Quad-Band GSM/GPRS

Enclosure, Display, Bottom - Injection Molded Polycarbonate, Printed, Clear Coat, Painted, w/ 2 Brass Threaded Inserts

Keypad Assembly - Injection Molded Plastic Keys, Painted, Printed, Chromed, on Silicone Rubber Substrate

FEM - Quad-Band Antenna Switch, w/ SAW Filters

Enclosure, Main, Top - Injection Molded Polycarbonate, Painted, Clear Coat, w/ 4 Brass Threaded Inserts

4-Layer - Flex Kapton

Enclosure, Main, Bottom - Injection Molded Polycarbonate, Painted

Enclosure, Display, Top - Injection Molded Polycarbonate, Painted

Enclosure, Main, Battery Cover - Injection Molded Polycarbonate, Painted

Total BOM Cost $37.48

LG KP151q Mobile Phone Cost AnalysisLG KP151q Mobile Phone Cost Analysis

What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

OEM/ODM/EMS Relationships / Manufacturing

Based on iSuppli's "Global OEM Manufacturing and Design Analysis - Q1 2009, LG contracts out manufacturing on KP model handsets to EMS providers such as Arima and Felxtronics. However, on the whole, LG's manufacturing profile is a majority 95% in house manufacturing. Specifically, in the Brazilian market, LG has manufacturing presence as well as their EMS partners.

Country of Origin / Volume Assumptions

Based on markings, the unit was assembled in Brazil. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in Brazil.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as display), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. ""Auto" inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

LG KP151q Mobile Phone - Enclosure DisassemblyLG KP151q Mobile Phone - Enclosure Disassembly

Design for Manufacturing / Device Complexity

The LG KP151q has an overall component count of 477 (excluding box contents), 118 of which are mechanical in nature. Within this context, the KP151q is one of the simplest flip phone handset designs we have come across and represents the low end of the handset complexity scale.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for Brazil.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Design Notes

Central to the KG KP151q's design is the use of TI's LoCosto chipset which features an integrates the digital baseband and RF radio in a single chip as well as another integrated analog baseband / power management single chip solution. Other major IC components include Skyworks power amplifier module (PAM), Spansion memory package and Silicon Lab FM radio solution.

Here is a summary of the major components used in the LG KP151q design:

Main PCB

Digital Baseband / RF Transceiver

  • Texas Instruments - D659IBQA (TI LoCosto)

Analog Baseband / Power Management

  • Texas Instruments - TWL3031FZPH (TI LoCosto)


  • Spansion - S71NS128PC0ZJETV

Power Amplifier

  • Skyworks - SKY77318-12

User Interface

  • Silicon Laboratories - Si4702-C19-GM -FM Radio Tuner


Display Module

  • Giantplus - GPM693F0 - 1.5' Diagonal, 65K CSTN, 128 x 128 Pixels


LG KP151q Mobile Phone - Box ContentsLG KP151q Mobile Phone - Box Contents

Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter


Date Event Location
12-16 Aug 2018 Vancouver, Canada
11-13 Sep 2018 Novi, Michigan
27 Sep 2018 The Reef, Los Angeles
03-05 Oct 2018 Boston, Massachusetts
26 Oct 2018 Old Billingsgate
Find Free Electronics Datasheets