In a deal designed to “further focus its portfolio and capital allocation on its core growth drivers,” Infineon Technologies AG has entered into an agreement to sell its NOR flash and F-RAM business to Winbond Electronics Corp.
The transaction does not include Infineon’s portfolio of specialty memory products like SRAM, HyperRAM, nvSRAM and SONOS-based radiation-hardened memory devices.
Infineon said these memory technologies continue its core growth portfolio in automotive, industrial, infrastructure, aerospace and defense applications.
The transaction, valued at $1.12 billion, will give Winbond additional memory devices to add to its memory portfolio.
“The transaction represents a highly compelling strategic outcome for all stakeholders,” said Peter Schiefer, president of Infineon’s Automotive Division. “It allows Infineon to further focus its portfolio and capital allocation on its core growth drivers. At the same time, it enables our NOR Flash and F-RAM business to unlock its full potential.”
Active acquisitions
Infineon has actively been circling the wagons to accelerate its core growth drivers of AI power delivery, automotive networking and sensing, wide bandgap power chips and edge/IoT microcontrollers. This means buying and selling its way to filter to high-margin, differentiated, hard-to-commoditize parts.
In August 2026, Infineon acquired C2i Semiconductors in a move that will further its portfolio of power-delivery systems for data-center architectures. This deal has even more weight in that it will further Infineon’s path to substrate-integrated voltage regulators (SIVRs), which the industry considers to be the next architectural leap in AI power delivery.
In July, the company opened what it claims to be the largest power chip/logic fab as part of its €5 billion investment at the Dresden, Germany, site.
But AI power chips were not the only expansion. In August 2025, Infineon spent about $2.5 billion to buy the Automotive Ethernet business from Marvell Technologies.
And the divestiture of the memory products here to Winbond wasn’t the only sell-off either. In July 2025, Infineon sold its 200 mm fab in Austin, Texas, to SkyWater Technology. Infineon has been actively expanding to 300 mm wafers including:
- Developing the first 300 mm GaN wafer
- Expanding its Malaysian fab to 300 mm wafers
- Building a 300 mm power fab buildout in Villach, Austria
