In what is claimed to be a first in silicon, xMEMS Labs has introduced an all-silicon, active micro-cooling fan-on-a-chip for ultramobile devices and next-generation artificial intelligence (AI) applications.
Called XMC-2400 µCooling, the chip can integrate active cooling technology into these devices. The chip is a solid-state, vibration-free cooling chip that measures 1 mm and weighs less than 150 milligrams. xMEMS said the chip is 96% smaller and lighter than non-silicon-based alternative cooling methods.
The chip can move up to 39 cubic centimeters of air per second with 1,000 Pa of back pressure. It also offers:
- Semiconductor reliability
- Part-to-part uniformity
- Robustness
- IP58 rated
The cooling chip is fabricated on xMEMS process that is used to create the company’s full-range of micro speakers for active noise cancellation in-ear wireless earbuds. xMEMS said it already has lined up several customers to use the XMC-2400 chip.
“Thermal management in ultramobile devices, which are beginning to run even more processor-intensive AI applications, is a massive challenge for manufacturers and consumers,” said Joseph Jiang, CEO and co-founder of xMEMS. “Until XMC-2400, there’s been no active-cooling solution because the devices are so small and thin.”
