Taiwan Semiconductor Manufacturing Co. (TSMC) is set to break ground on its new Dresden, Germany, fab this week to boost regional manufacturing in Europe.
According to a report from Economic Daily News, the TSMC Dresden facility is anticipated to use 28/22 nm planar CMOS and 16/12 nm FinFET process with a monthly production capacity of about 40,000 300 mm wafers.
The fab is part of TSMC’s nearly $100 billion investments to expand its semiconductor manufacturing outside of its home base in Taiwan to Europe, the U.S. and Japan. Currently, TSMC is building up to three fabs in the state of Arizona in the U.S. They are also set to build two fabs in Japan, a huge investment that is drawing more than 100 chip investments in the Kyushu, Japan, since these facilities were announced in 2021.
Attracting additional vendors
Much like the fabs in Japan, TSMC’s decision to build a fab in Germany is attracting more companies to invest in the region.
TSMC announced it would build its German fab about one year ago and invest about $11 billion with the hope that it will garner direct funding from the European Chips Act. This investment is pushing other companies to take advantage of the buzz happening in the region.
This includes:
- Taiwanese fab tool maker Marketech International setting up offices and deploying staff.
- Taiwanese materials vendor Topco Scientific establishing operations in Prague, just a few hours from Dresden.
