Taiwanese chipmaker MediaTek has unveiled a new modem and chipset to support the emerging 5G reduced capability (RedCap) standard including what it claims is the first 6 nm radio frequency system-on-chip (RFSOC) single die for the technology.
RedCap is designed to bring 5G connectivity to devices and sectors that have low bandwidth requirements like consumer electronics, enterprise and industrial. This allows these areas to get the benefits of 5G — the bandwidth, speed and latency — without the cost or complexity of typical 5G solutions like smartphones and tablets.
MediaTek’s RFSOC will allow companies to create designs for RedCap for augmented reality, wearables, data card application and more. The RFSOC is manufactured by Taiwan Semiconductor Manufacturing Co. (TSMC) and integrates a single-core Arm Cortex-A35 microprocessor.
Other features of the T300 series chipset and M60 5G modem include:
- Up to 227 Mbps downlink
- 122 Mbps uplink data rates
- 70% reduction in power consumption
- 75% power savings compared to 4G
- Supports the 3GPP R17 standard
- Up to 256 QAM DL/UL
- Networking slicing
- LTE and NR-FR1 (20 MHz)