MEMS and Sensors

Report: Toshiba to split into three companies

10 November 2021

Toshiba, an electronics manufacturer in Japan, is set to divide into three companies to strengthen the focus and growth strategies of three distinct businesses.

The three companies will be divided into infrastructure, devices and semiconductor memory with the move coming as early as 2023, according to Nikkei Asia. The three companies will be listed publicly, creating independent profit structures and growth strategies.

Under the restructuring plan, Toshiba’s power stations and other infrastructure business will be placed under one company and non-chip devices including hard drives under a different company. Finally, its semiconductor business is expected to become a third company under Kioxia Holdings, in which Toshiba has about a 40% stake.

Dividing into separate companies may give investors clearer insight into the various businesses as conglomerates such as Toshiba may spread a company too thin, dragging down company resources.

A more specific driven company would give these businesses better decision making, raise new funds or pursue acquisitions and divestitures quickly.

To contact the author of this article, email engineering360editors@globalspec.com


Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement
Find Free Electronics Datasheets
Advertisement