New Yorker Electronics is distributing the new Gowanda Electronics’ four ceramic wirewound chip inductor series with no internal solder connections. The inductors increase reliability in space/aero programs and are also military QPL-approved, built and tested to meet M83446.
Part of Gowanda’s H-Core solution, these chip inductors are designed to offer a solution to those facing challenges with their traditional molded inductors. In addition to no internal solder connections, its winding is fully UV-protected, and coil forms are readily available. The inductors feature co-fired terminations and fully encapsulated designs are available for extra durability.
Excellent for high frequency applications, at only 1.20 mm x 0.065 mm x 0.7 0mm the CC0402 weighs less than 0.05 g and is suitable for reflow soldering. Its capacitance options range from 10 nH to 4,700 nH with DC currency ratings from 220 mA to 1,000 mA with a tolerance of 2%. It has an operating temperature range of -55° C to 125° C and like all four series it has a flat top cover for ‘pick and place’ and is suitable for reflow soldering.
The CC0603 is available in three tolerance options of 10%, 5% and 2%. It ranges in capacitance options from 1.8 nH to 330 nH and DC currency ratings from 179 mA to 1000 mA. It is 1.80 mm x 1.12 mm x 1.02 mm and weighs less than 0.05 g with an operating temperature range of -40° C to 125° C.
The CC0805 has a capacitance range of 2.4 nH to 2,200 nH and a DC currency range of 140 mA to 1,000 mA with an operating range of -55° C to 125° C. It is 2.41 mm x 1.78 mm x 1.52 mm with available tolerance options of 10%, 5% and 2%.
The CC1008 is 2.92 mm x 2.80 mm x 2.28 mm and has an operating temperature of -40° C to 125° C. It ranges in capacitance from 10 nH to 4,700 nH and in DC currency from 220 mA to 1,000 mA. It offers tolerances of 5% and 2%.
All four series ensure low power consumption, high chemical resistance, vibration/shear resistance, electrical and mechanical integrity, and durability during handling. Gowanda also makes implantable device components for biomedical applications.