Discover our System-in-Package services to make systems smaller with improved performances

Discover how we intend to improve the semiconductors assembly integration using our System-in-Package services to make systems smaller with improved performances and a reduced time to market thanks to a single supplier.

While collaborating with us, you will benefit from our 60 years of experience as a semiconductor manufacturer. Our teams have developed a new approach to design systems for high-end and high reliability applications such as space, aerospace or defense. Our System-in-Package solution allows lighter and smaller components with increased performances suitable for the harshest environments.

We provide global assembly services with tailor made solutions to fit at best your needs: flip-chip, wire bond, ceramic or organic substrate and heterogeneous dies. Collaborating with Teledyne e2v’s experts during the entire development process (substrate design, thermal and electromagnetic simulation and entire manufacturing process) will allow us to build the most reliable and adequate solution for your project.

For higher reliability, our teams ensure a wide range of tests including visual inspection, screening, burning and temperature testing.

Bring your components to the most demanding standards thanks to our quality certifications: AS9100, QML classes V and Y. We provide ITAR-Free components. Moreover, you will also benefit from a long-term availability (up to 20 years) thanks to our obsolescence management program and our storage facilities.

Teledyne e2v is the supplier you should trust for your System-in-Package solution dedicated to high reliability applications. Get more information about your SiP partner or get in contact with our experts at teledyne-e2v.com/IMS.