Ironwood Electronics has recently introduced a new high-performance elastomer socket for 0.35 mm pitch ball grid array (BGA) package. The SG25-BGA-2056 socket is designed for a 2.28 mm x 2.28 mm package size and operates at bandwidths up to 52 GHz with less than 1 dB of insertion loss. The contact resistance is typically 20 milliohms per pin.
The socket is mounted using supplied hardware on the target PCB with no soldering, and uses the smallest footprint in the industry. The small footprint allows inductors, resistors and decoupling capacitors to be placed very close to the device for impedance tuning. The socket also incorporates a simple swivel hardware installation method so that ICs can be changed out quickly.
The SG25-BGA-2056 sockets are constructed with high performance and low inductance elastomer contactor. The temperature range is -35° C to 125° C. The pin self inductance is 0.06 nH and mutual inductance of 0.019 nH. Capacitance to ground is 0.129 pF and mutual capacitance is 0.017 pF. Current capacity is 2 amps per pin.
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