The two new inspection systems. Source: KLA-TencorKLA-Tencor Corp. has introduced two inspection systems that help accelerate packaging yield and increase die sort accuracy.
The Kronos 1080 system offers high sensitivity wafer inspection for advanced packaging for process control and material disposition. The inspection tool uses multi-mode optics and sensors as well as advanced defect detection algorithms to identify defects for inline process control.
This system also includes FlexPoint, a technology derived from KLA-Tencor’s inspection solutions for IC chip manufacturing. FlexPoint focuses the system on key areas in the die where defects would have the highest impact.
Meanwhile, the ICOS F160 system examines packages after wafers have been diced for accurate die sort based on detection of key defect types such as sidewall cracks, which is a new defect type affecting the yield of high-end packages. These cracks result from a change in the materials used to insulate the dense on-chip metal routing to facilitate increased speed and reduced power consumption. The material is brittle and susceptible to cracks during wafer dicing. Sidewall cracks are difficult to detect and are not detectable using traditional visual inspection. The tool can be changed from configuration to another and automatic calibrations and precision die pickup facilitate increased tool utilization in high volume manufacturing environments.
