Acquired Electronics360

Industrial Electronics

SEMICON West 2018: Leti and Soitec Launch Substrate Innovation Center

11 July 2018

Emmanual Savnnadiere, CE of Leti.  Source: Electronics360Emmanual Savnnadiere, CE of Leti. Source: Electronics360

Leti, the French R&D giant, and Soitec, a world leader in innovative semiconductor materials, today announced a new collaboration and five-year partnership agreement to drive the R&D of advanced engineered substrates, including silicon on insulator (SOI).

This agreement brings the traditional Leti-Soitec partnership to a whole new dimension and includes the launch of a world-class prototyping hub. The Substrate Innovation Center will offer access to shared Leti-Soitec expertise around a focused pilot line. Key benefits for partners include access to early exploratory sampling and prototyping, collaborative analysis and early learning at the substrate level, eventually leading to streamlined product viability and roadmap planning at the system level.

Emmanual Savonnadiere, CEO of Leti, discussed the new partnership with Electronics360 during a news announcement. Leading chip makers and foundries worldwide use Soitec products to manufacture chips for consumer applications targeting performance, connectivity and efficiency with extremely low energy consumption. Applications include smartphones, data centers, automotive, imagers and medical and industrial equipment, but this list is always growing, along with the need for flexibility to explore new applications starting at the substrate level.

At the Substrate Innovation Center, located on Leti’s campus, Leti and Soitec engineers will explore and develop innovative substrate features, expanding to new fields and applications with a special focus on 4G/5G connectivity, artificial intelligence, sensors and display, automotive, photonics and edge computing.

“Material innovation and substrate engineering make entire new horizons possible. The Substrate Innovation Center will unleash the power of substrate R&D collaboration beyond the typical product roadmaps, beyond the typical constraints,” said Paul Boudre, Soitec CEO. “The Substrate Innovation Center is a one-of-a-kind opportunity open to all industry partners within the semiconductor value chain.”

See the press release from Leti.

To contact the author of this article, email abe.michelen@ieeeglobalspec.com


Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement

CALENDAR OF EVENTS

Date Event Location
12-16 Aug 2018 Vancouver, Canada
11-13 Sep 2018 Novi, Michigan
27 Sep 2018 The Reef, Los Angeles
03-05 Oct 2018 Boston, Massachusetts
26 Oct 2018 Old Billingsgate
Find Free Electronics Datasheets
Advertisement