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New eBook from Mouser and Analog Devices explores power efficiency and robustness in electronics design
Topics include effective electromagnetic interference management and managing power supply noise with voltage supervisors.
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ROHM at Electronica 2024: Empowering growth, inspiring innovation
ROHM will showcase its advanced power and analog technologies designed to enhance power density, efficiency and reliability in both automotive and industrial applications.
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Rohde & Schwarz achieves full coverage of Skylo's test plan for NB-NTN devices, enabling SMS services
Rohde & Schwarz has successfully achieved full coverage of Skylo's comprehensive test plan for devices operating in narrowband-IoT in non-terrestrial networks (NB-NTN).
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Video: mmWave sensors — What you need to know
Why they are gaining traction in a range of applications.
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Direct metallization: The future of UHDI and packaging
IC substrates in advanced packages and UHDI PCBs demand higher reliability primary metallization processes such as direct metallization.
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AI boosts chip revenue to new heights in 2025
Revenues will grow by 14% to reach $717 billion.
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Vishay Intertechnology IGBT and MOSFET drivers in stretched SO-6 package enable compact designs, fast switching and high voltages
The devices are ideally suited for directly driving insulated-gate bipolar transistors (IGBTs) with ratings up to 1,200 V/100 A.
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Compact, SIL-2 rated thermal FS10A switch/monitor verifies liquid or gas analyzer flow in tight places
The universal flow switch and monitor is specifically designed for liquid and gas process analyzer sampling systems.
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Two- vs three-level voltage source converters
A two-level voltage source converter (VSC) produces a square-wave output rich in harmonics while a three-level VSC generates a stepped waveform with three levels, yielding a lower harmonic content.
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PEI-Genesis now offers LMR connectors, cables and accessories from Times Microwave Systems
The products include fire-retardant cables, space assemblies, tools and accessories such as grounding kits and shrink boots.
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HMS Networks expands range of embedded communication interfaces with the Anybus CompactCom B40 Mini
Soldered directly onto a device’s carrier board, this communication interface is 30% smaller than the pluggable brick, making it ideal for small devices.
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Q&A with Peter Schneid, Harwin VP of marketing, on interconnect design and Electronica 2024
Schneid offers a unique glimpse of the state of the interconnect market - as well as what he's looking forward to at Electronica 2024.
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Micro Crystal’s new C8 series RTC: Ultra-small real-time clock modules
These modules are geared for compact and lightweight designs, paving the way for engineers striving to create smaller and more efficient electronic devices.
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New network security innovations aim to outpace cyber threats
What solutions for engineers work now and what might work even better in the future.
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Automotive AEB makes strides at improving driver safety
The ADAS technology worked great at low speeds but struggled at speeds higher than 45 mph.
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5G mmWave: Two steps toward commercialization
Two trials from Vodafone, Ericsson and Qualcomm show the benefits of the technology.
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EMI suppression in the low-frequency range directly on the busbar
Würth Elektronik has expanded its ferrite range for electromobility applications.
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Are Intel and Samsung exploring a foundry alliance?
The goal would be to challenge chip manufacturing leader TSMC.
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5G RedCap goes mainstream
TCL’s device provides secure and fast connections without Wi-Fi.
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Vishay Intertechnology extends voltage rating options for four-terminal snap-in aluminum electrolytic capacitors
Designed for power supplies and industrial and home appliance inverters, the series reduces component counts and lowers costs while increasing mechanical stability and end-product lifetimes.
