As designers continue to replace through-hole devices requiring wave soldering with higher-temperature equivalents, PiP technology has emerged as a new cost-effective method for mounting the components—together with surface-mount packages—via reflow soldering. In the PiP process, after components are positioned on the PCB, the entire board is soldered at once using only the reflow oven, eliminating the wave-soldering step for through-hole devices. This results in a more reliable solder process flow at a lower cost. The holder is available for PCBs with thicknesses from 1.0 mm to 1.6 mm. Featuring three-point, surface-mount solderable tabs, the P1xP reduces the number of automatic insertion points, while improving co-linearity and grounding for better RF and EMI rejection. Dry-packed in stiff plastic trays for automatic pick-and-place assembly, the holders feature a large pick-and-place area and clips to securely hold the IR receiver module.
For products such as televisions, set-top boxes, air conditioners and high-end audio systems, Vishay’s Minimold devices provide high sensitivity with typical irradiance of 0.08 mW/m2 at 0° for the TSOP33xxx series and 0.12 mW/m2 for the TSOP53xxx series. The Minimold package is also available with the proven “F” option for an enhanced optical filter against out-of-band optical noise, while TSOP53xxx series devices are highly resistant to RF interference. The devices are also available in a top-view surface-mount version.