Mobile Devices

Siemens MC60 Mobile Phone Teardown

14 July 2004
The following is an overview of a teardown analysis conducted by IHS Benchmarking.

  • This phone is internally identical to the C60 previously analyzed with the addition of the camera and image processing circuitry.
  • Tri-band GSM / GPRS
  • Low end multimedia (CIF cam / basic LCD / messaging)
  • Integrated solution in the RF front-end
  • Tri-band FEM: PIN diode antenna switch with RX RF SAW filters
  • Currently this integrated part my be more expensive than the discrete alternatives
  • Seperate imaging processor IC used for camera interface
  • Typically have not seen sepearte processors for cameras

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