Mobile Devices

Sony Ericsson W580i Mobile Phone Teardown

15 June 2008
The following is an overview of a teardown analysis conducted by IHS Benchmarking.

Overview

The SonyEricsson W580i is a mid-range Walkman phone, within the Walkman Phone Series, from SonyEricsson. This model is a mid-range GSM/EDGE slider phone with a basic feature-set and a few added features such as Bluetooth, FM Radio, and Shake Control.

Sony Ericsson W580i Mobile Phone Main ImageSony Ericsson W580i Mobile Phone Main Image
Target Market

Mainstream users with focus on the music-oriented segment. This is a mid-market GSM/EDGE phone.

Release / Availability

July, 2007.

Pricing

Available online at the time of writing from AT&T for $279.99.

Volume Estimations

For the purposes of this teardown analysis, we have assumed a lifetime production volume of 2.4 Million units.

As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

Sony Ericsson W580i Mobile Phone - Main PCB TopSony Ericsson W580i Mobile Phone - Main PCB Top

ISuppli's Design Forecast Tool (DFT) and Market Shares

As part of iSuppli's Design Forecast Tool (DFT), we forecast handset shipments by major design feature and manufacture, as well as the number of design starts a manufacturer will have by feature set.

From our Design Forecast Tool (DFT), we estimate unit shipments of 360 million units of EDGE handsets in the 2008 global market. We further estimate unit shipments of 289 million 2Mpx camera phones in the 2008 global market.

Sony Ericsson W580i Mobile Phone Cost AnalysisSony Ericsson W580i Mobile Phone Cost Analysis
Sony Ericsson W580i Mobile Phone Cost Analysis
What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself, cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Sony Ericsson W580i Mobile Phone - Main PCB BottomSony Ericsson W580i Mobile Phone - Main PCB Bottom

Manufacturing Notes

SonyEricsson Relationships / Manufacturing

Per iSuppli's Global OEM Manufacturing and Design Analysis (GOMDA), we estimate that SonyEricsson outsources approximately two-thrids of its production to EMS providers such as Flextronics and Foxconn, as well as ODMs like Arima and Compal.

Country of Origin / Volume Assumptions

Based on markings, the unit was assembled in Malaysia. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were all domestically sourced in Malaysia.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as Bluetooth modules), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Sony Ericsson W580i Mobile Phone - Enclosure DisassemblySony Ericsson W580i Mobile Phone - Enclosure Disassembly

Design for Manufacturing / Device Complexity

The W580i has a total component count (less box contents) of 718 components, of which 85 are mechanical in nature ?" this seems well within the norms for a phone with this type of feature set.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Design Notes

The W580i design shares much in common with many previously analyzed SonyEricsson models and demonstrates SonyEricsson's commitment to leveraging common parts across multiple models. The W580i design is based on a core Texas Instruments DBB (D761761B2Z - common to 4 other models previous seen), and a TI applications processor (D751543ZQ). As is also often the case in previously analyzed SonyEricsson models, the analog baseband / power management portion is handled by the TI TWL93016FZQW such as those found in 8 other SonyEricsson handsets we have analyzed. The RF section is handled by 1 discrete Texas Instruments chip (RF2010 - RF Transceiver - GSM), and a Skyworks PAM (SKY77329-15 (GSM)).

Baseband

DBB - Digital Baseband - Texas Instruments - D761761B2Z

DBB - Applications Processor - Texas Instruments - D751543ZQ

Analog Baseband / Power Management

Power Management IC - Texas Instruments - TWL93016FZQW

Memory

MCP - Intel - PF38F5060M0Y0BE - 512Mb NOR Flash + 128Mb SDRAM, 1.8V, 90nm

RF Transceiver

RF Transceiver - Ericsson (Texas Instruments) - RF2010

FEM - Epcos - D2027 - Quad-Band GSM/GPRS/EDGE + Single-Band WCDMA

Power Amplifiers (PAM)

PAM (GSM) - Skyworks - SKY77329-15 - Quad-Band

User Interface

FM Radio - NXP Semiconductors - TEA5766UK

USB Transceiver - Maxim - MAX3349EAEE - USB2.0

Bluetooth - ST Microelectronics - STLC2500C

Lighting Management Unit - Austriamicrosystems - AS3689

Inertial Sensor - ST Microelectronics - LIS2L06AL

Display

2.0' Diagonal, 262K Color TFT, 240 x 320 Pixels

Camera Module

Primary - 2.0MP, CMOS, 1/4' Format, Fixed Lens

Sony Ericsson W580i Mobile Phone - Box ContentsSony Ericsson W580i Mobile Phone - Box Contents



Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the GlobalSpec
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement