Toshiba Portege R700 Notebook Computer Teardown

Overview / Main Features

The Toshiba Portege R700 is a business-oriented notebook computer powered by an Intel Core i3-350M processor and HM55 Express Chipset. This 13.3 inch laptop under analysis is configured with 2GB of DDR3-1066 of memory [on single SO-DIMM module], a 500GB hard-disk drive, Broadcom 802.11n-capable WLAN module, as well as a lithium ion 6-cell battery. Also, the Toshiba Portege R700 comes with a CD/DVD RW optical drive and an integrated 1.3MP webcam.

Toshiba Portege R700 Notebook Computer Main Image

Business / Enterprise

Released

Per press releases, first release in June 2010.

Toshiba Portege R700 Notebook Computer - Motherboard Top

Pricing - The Toshiba Portege R700 is listed on the Toshiba US website for approximately $899 (however, this configuration comes with 4GB of memory).

Availability - Assumed global

Volume Estimations

For the purposes of this teardown analysis, we have assumed a lifetime production volume of 900,000 units.

As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

Toshiba Portege R700 Notebook Computer - Motherboard Bottom

Main Cost Drivers Representing ~82% of total materials cost

Intel - CN80617004161AC - CPU - Intel Core i3-350M Processor, Dual Cores, 2.26GHz, 3MB L3 Cache, 32nm Process

Panasonic - UJ892 - DVD/CD RW Drive - Slim Internal Type, Tray Load, SATA

Hitachi - HTS545050B9A300 - Hard Drive - 500GB, 2.5', SATA 3.0Gb/s, 5400RPM, 8MB Buffer

Toshiba - LT133EE09D00 - Display Module Value Line Item - 13.3' TFT LCD, TN Mode, 1366 x 768 Pixels, LED Backlight

PA3832U-1BRS - Battery Pack - Li-ion, 6-Cell, 10.8V, 5800mAh, 66Wh

Samsung Semiconductor - M471B5673FH0-CF8 - SO-DIMM DDR3-1066 - 2GB, 256Mbx64, 1.5V

Intel - BD82HM55SLGZS - Platform Controller Hub - HM55 Express Chipset, 65nm Process, 3.5W, w/ Integrated Graphics

UniMicron Technology - 8 Layer - FR4, Lead-Free

Delta Electronics - PA3714E-1AC3 - AC Adapter - 19V, 3.42A, 65W, w/ 6ft Cord & Velcro Strap

Broadcom - BCM94313HMGB - WLAN / Bluetooth Module Value Line Item - IEEE802.11b/g/n Single- Stream, Bluetooth V2.1+EDR

Webcam PCB - Contains 1.3MP (Assumed) Camera Module, USB2.0 PC Camera Controller, 64Kb EEPROM

Keyboard Assembly - Injection Molded Plastic Keys, Mounted on Metal Backing Plate, w/ Interconnect Flex

Cooler Assembly - Stamped / Formed Metal Mounting Bracket, Stamped / Formed Metal Plate, Copper Tube, Aluminum Fins

Enclosure, Display, Top - Die-Cast Magnesium Alloy, Painted, w/ Insert-Molded Plastic

Enclosure, Main, Bottom - Die-Cast Magnesium Alloy, Painted, Printed

Enclosure, Main, Top - Die-Cast Magnesium Alloy, Painted, Printed, Brushed

Synaptics - Touchpad Assembly

Maxim - MAX17428GTJ+ - Power Supply Controller - Step-Down, Quick-PWM, 1-Phase, for Intel notebook CPUs

Maxim - MAX17434GTL+ - PWM Controller - Dual Phase, w/ Transient Suppression, for IMVP6+/IMVP6.5

Materials and Manufacturing $433.05

Toshiba Portege R700 Notebook Computer Cost Analysis

What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

Toshiba's Mobile PC manufacturing profile, according to iSuppli's Global OEM Manufacturing and Design Analysis - GOMDA), is 14.8% In-house and 85.2% outsourced with Inventec, Compal and Quanta, accounting for 38.8%, 31.2% and 14.1% respectively of their out-sourced output capacity.

Country of Origin / Volume Assumptions

Based on markings, the unit was likely assembled in China. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in China.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as display module), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Design for Manufacturing / Device Complexity

The Toshiba Portege R700 has an overall component count of 2158 (excluding box contents), of which 1426 resides on the motherboard. This level of complexity is on par with comparable notebook computers we have analyzed in this category.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Design Notes

Here is a summary of the major components used in the Toshiba Portege R700 Laptop design:

Display

• Display Module - Toshiba - LT133EE09D00, 13.3' TFT LCD, TN Mode, 1366 x 768 Pixels, LED Backlight

Motherboard

Chipset

• Platform Controller Hub (HM55 Express Chipset) - Intel - BD82HM55SLGZS, 65nm Process, 3.5W, with Integrated Graphics

CPU

• Core i3-350M Processor - Intel - CN80617004161AC, Dual Cores, 2.26GHz, 3MB L2 Cache, 32nm Process

I/O & Interface

• Embedded Controller - SMSC - MEC1609-PZP
• Microcontroller - Toshiba Semiconductor -TMP86FS49BUG
• Memory Card Reader Controller - Ricoh - R5U230
• Ethernet Controller - Intel - WG82577LC, 10/100/1000 Mbps, PCI Express Interface

Power Supply

• PWM Controller - Maxim - MAX17434GTL+
• Power Supply Controller - Maxim - MAX17428GTJ+

Clock

• Clock Generator - IDT - 9LVRS394CKLF

Memory Module

• SO-DIMM DDR3-1066 - Samsung Semiconductor - M471B5673FH0-CF8, 2GB, 256Mbx64, 1.5V

Communication Modules

• WLAN / Bluetooth Module - Broadcom - BCM94313HMGB

Storage Devices

• DVD/CD RW Drive - Panasonic - UJ892, Slim Internal Type, Tray Load, SATA
• Hard Drive - Hitachi - HTS545050B9A300500GB, 2.5', SATA 3.0Gb/s, 5400RPM, 8MB Buffer

Battery

• Battery Pack - Li-ion, 6-Cell, 10.8V, 5800mAh, 66Wh

Toshiba Portege R700 Notebook Computer - Box Contents