Mobile Devices

HTC S310 Mobile Phone Teardown

08 August 2007
The following is an overview of a teardown analysis conducted by IHS Benchmarking.

Main Features

The HTC S310 is a candybar Microsoft Windows Mobile 5.0 smartphone. It is a quad-band GSM/EDGE device with a 2' LCD (not touchscreen), 1.3MP camera (no flash), featuring Bluetooth 2.0 EDR, polyphonic ringtones, 512Mb (64MB) of NAND Flash and 512Mb (64MB) of SDRAM as well as a MiniSD expansion slot.

HTC S310 Mobile Phone Main ImageHTC S310 Mobile Phone Main Image
Overview

The HTC S310 looks like a basic bare-bones PDA phone. The 'bare bones' comes from the fact that there is no touch screen, and it is otherwise a basic candybar format without a particularly large screen (2' is fairly run of the mill of non smart phones these days). It does offer, however, all of the features one would expect or want from such a device including memory expansion, Bluetooth 2.0, USB connectivity, however I think that the lack of touchscreen or an innovative pointing device such as the RIM 'Pearl' or scrolling clickwheel, or other user interfaces will ultimately hinder useability. In all fairness, not having tested the device we can't say conclusively.

Target Market

Per HTC press release, the HTC S310 is 'ideal for business and consumer users' and is a 'small yet powerful candy bar-style messaging device'. Based on the other smart phone devices release simultaneously, it would appear that this is the low-end of their smartphone portfolio releases in 2006.

HTC S310 Mobile Phone (iSi) - Enclosure DisassemblyHTC S310 Mobile Phone (iSi) - Enclosure Disassembly
Released

Per press releases - September 2006.

Pricing and Availability

Per HTC's website and press releases it seems that this product has a European marketing focus for this device and can be offered in custom variants via service providers. Street prices unsubsidized found online are all approximately in the $400 USD range.

Volume Estimations

Based on HTC's market shares, and our estimates of market volume shipments by manufacturers and market segments (see iSuppli Design Forecast Tool (DFT) data below), we are assuming a total production volume for this model of 270K units over a 2-year lifetime.

As a reminder, teardown volume production assumptions are meant primarily to be used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs 2) rarely have a large net effect on our final analysis because of this.

ISuppli's Design Forecast Tool (DFT) and Market Shares

As part of iSuppli's Design Forecast Tool (DFT), we forecast handset shipments by major design feature and manufacture, as well as the number of design starts a manufacturer will have by feature set.

From our most recent revision of this tool iSuppli estimates shipments of 74M quad-band EDGE (800/900/1800/1900) handsets in 2007 for the entire world market. Furthermore, we estimate a total of 16 million Windows-based mobile phones in 2007 (of which this model is a part). However, given HTC's paltry market share, we have assumed production volumes for this particular model will be modest, and will depend largely on pick-up by a major service provider, such as T-mobile, who have, in the past, offered HTCs XDA series PDAs.

Function / Performance

Functional testing was not performed on the HTC S310.

HTC S310 Mobile Phone Cost AnalysisHTC S310 Mobile Phone Cost Analysis
Cost Notes

Main Cost Drivers Representing ~73% of total materials cost

Texas Instruments - OMAP850AZVL - DBB - Digital Baseband Processor & Applications Processor - 130nm

Display Module - 2' Diagonal, 65K Color TFT, 176 x 220 Pixels

Camera Module - 1.3MP CMOS, 1/4' Format - Fixed Lens

Samsung Semiconductor - K4X51163PC - SDRAM - Mobile DDR, 512Mb (32M x 16)

Celxpert - ST26B - Battery - Li-Ion, 3.7V, 1150mAh

Texas Instruments - TWL3027BZQW - ABB - Analog Baseband / Power Management

Unimicron - Main PCB - 8-Layer - FR4/RCF HDI, 1+6+1

Samsung Semiconductor - KFG1216Q2A-DEB5 - Flash - SLC, OneNAND, 512Mb, 54MHz, Pb Free

LEDs - High Intensity White

Texas Instruments - BRF6150 - Bluetooth - Single Chip Solution, V1.2, 130nm Process

RF Micro Devices - RF3158 - PAM - Quad-Band, GSM/GPRS/EDGE

Infineon - PMB6272 - RF Transceiver - Quad-Band, GSM850/EGSM900/DCS1800/PCS1900, ZIF, w/ Integrated VCO

FEM - Quad Band, Contains 2 Single Band & 1 Dual Band RX SAW Filters, 4 RF Pin Diodes

Keypad Assembly - Injection Molded Plastic Keys, Silkscreened and Painted, on Silicone Rubber Substrate, w/ Injection Molded Plastic Support

Total BOM Costs $82.77

Total BOM & Manufacturing Costs $88.58

What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing and test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself ?cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

HTC Relationships / Manufacturing

HTC is an important ODM partner offering smartphones and PDAs to a number of international service providers, including Vodafone. Vodafone is in fact one of HTC's top customers. We believe that HTC are producing most of their phones in house. In fact, iSuppli globally sees that about 80% of handsets (all manufacturers mixed) in 2006 are produced 'in-house' by handset OEMs or ODMs, with a growing percentage of EMS-produced devices. HTC, as a Taiwanese company is assumed in our teardown analysis to produce, when possible, and where noted on the labels in mainland China, and sometimes in Taiwan.

Country of Origin / Volume Assumptions

This product is labeled as Made in China, furthermore, we have assumed that for this model, that PCB was also populated in China, and that custom mechanicals (plastics and metals) were also sourced domestically in China.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as chargers), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

The issue of labor rates was revisited in Q2 2006 as we began to apply some research by one the major worldwide EMS suppliers and are now applying some of their research on total loaded costs by country and region to arrive at these new rates which are pronouncedly higher on the low end in China. Remember that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines.

Design for Manufacturing / Device Complexity

It's not always easy to find a model that is a good comparison point with respect to another, but in this case let's look at this phone with respect to the recently analyzed Blackberry Pearl, which was also basically a monoblock smartphone in a standard candybar form factor. The HTC S310 has an average total component count of 712 vs. a total count of 623 in the Pearl. It is actually a little odd that the component count is higher than the Pearl (8100) as it also featured the very unique trackball 'Pearl' pointing device.

Having said that - the total component count in this HTC device seems modest when compared with previously seen HTC devices which always seemed to a take a very discrete (as opposed to integrated) approach to adding features. The result seemed to always be a huge amount of discrete components, more complex high-density interconnect PCBs with elevated layer counts. The crowning achievement for HTC was the XDAIII which sported almost 1500 components! Let that put smartphone complexity into perspective for you.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Design notes

The primary chips used in this design are the OMAP850 DBB/apps processor from TI, as well as the TWL3027 ABB chip from TI. Both this model and the QTEK8500 feature this same core chipset.

Here is a summary of the major components used in the HTC S310 design:

Main PCB

Baseband

  • DBB - Texas Instruments - OMAP850AZVL - Digital Baseband Processor & Applications Processor - 130nm
  • ABB - Texas Instruments -TWL3027BZQW - Analog Baseband / Power Management

Battery / Power Management

  • Battery Charger - Intersil - ISL9203CRZR5220 - Li-ion/Li Polymer, 1.5A, 1%

Memory

  • Flash - Samsung Semiconductor - KFG1216Q2A-DEB5 - SLC, OneNAND, 512Mb, 54MHz, Pb Free
  • SDRAM - Samsung Semiconductor - K4X51163PC - Mobile DDR, 512Mb (32M x 16)

RF/PA

  • PAM - RF Micro Devices - RF3158 - Quad-Band, GSM/GPRS/EDGE
  • RF Transceiver - Infineon - PMB6272 - Quad-Band, GSM850/EGSM900/DCS1800/PCS1900, ZIF, w/ Integrated VCO

User Interface

  • Texas Instruments - BRF6150 - Bluetooth - Single Chip Solution, V1.2, 130nm Process

Camera Module

  • Image sensor - Micron Technology - MT9M112 - 1.3MP, CMOS, 1/4?Format - 2.8um x 2.8um Pixel Size, 3.6mm x 2.9mm Active Image Area

Display Module

  • 2' Diagonal, 65K Color TFT, 176 x 220 Pixels

HTC S310 Mobile Phone (iSi) - Box ContentsHTC S310 Mobile Phone (iSi) - Box Contents



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