Mobile Devices

HP 2133 Mini-Note PC Notebook Computer Teardown

03 December 2008
The following is an overview of a teardown analysis conducted by IHS Benchmarking.

Overview / Main Features

The HP 2133 Mini-Note PC is a low cost, ultra mobile PC designed for the education market. It represents HP's first foray into the emerging value-notebook or "netbook mobile PC category which iSuppli expected to grow at a 20% CAGR in the next 4 years. The HP 2133 finds itself in large competitive set with the likes of Asus, MSI, Acer, Dell and FIC.

HP 2133 offers users an usable 8.9 inch WXGA display to complement the full size QWERTY keyboard, 1GHz VIA C7-M processor similar to the one found in the Everex Cloudbook previously analyzed by iSuppli, 512MB SDRAM and a 4GB SSD. This particular HP 2133 comes preconfigured with SUSE Linux Enterprise Desktop 10 operating system which helps to keep cost below $500. The ultra portable laptop weighs in at less than 3lbs (1.3kg) but features user amenities such as integrated webcam, ExpressCard/54 and SD/MMC memory card slots.

HP 2133 Mini-Note PC Notebook Computer Main ImageHP 2133 Mini-Note PC Notebook Computer Main Image

Target Market

Education market (as well as other [worldwide] emerging markets)


Per press releases, first release in April of 2008.

HP 2133 Mini-Note PC Notebook Computer - Motherboard TopHP 2133 Mini-Note PC Notebook Computer - Motherboard Top

Pricing and Availability
Pricing - Based on the configuration of the device under analysis, the HP 2133 Mini-Note PC retails for $499 at the time of writing (Oct. 10, 2008) directly from


- presumed global availability

Volume Estimations

For the purposes of this teardown analysis, we have assumed a lifetime production volume of 1M units.

As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed, volumes increment by an order of magnitude. Minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis.

HP 2133 Mini-Note PC Notebook Computer - Motherboard BottomHP 2133 Mini-Note PC Notebook Computer - Motherboard Bottom

Market / Sector Performance

Per iSuppli's Compute Platforms Market Tracker (Q2 2008), HP leads the worldwide PC shipments with 18.9% of the estimated 300M volume. However, in terms of the emerging netbook, HP is a relative new-comer into a rather crowded market space lead by Asustek.

HP 2133 Mini-Note PC Notebook Computer Cost AnalysisHP 2133 Mini-Note PC Notebook Computer Cost Analysis

Main Cost Drivers Representing ~70% of total materials cost

Chi Mei Optoelectronics - N089A1-L01 - Display Module Value Line Item - 8.9" TFT LCD, 262K Color, 1280 x 768 Pixels (WXGA), 151um x 151um Pixel Size, 116.4mm x 193.9mm Viewable Area, 200cd/m^2, 300:1 Contrast Ratio, 16ms Response Time

VIA Technologies - C7-M - CPU - 1.2GHz, 400MHz FSB, 90nm, 5W

VIA Technologies - CN896 - Northbridge - Graphics & Memory Controller Hub

Dynapack - Battery - Li-Ion, 10.8V, 2600 mAh

ProMOS Technologies - V916764B24QCFW-F5 - SODIMM DDR2 - 512MB, 64Mx64, 667MHz

UniMicron Technology - 8-Layer - FR4, Lead-Free

Li Shin International - AC Adapter / Charger - 18.5V, 3.5A, 65W

Broadcom - BCM94312MCG - WLAN Mini PCIe Module Value Line Item - IEEE802.11a/b/g

VIA Technologies - VT8237S - Southbridge - I/O Controller Hub

Chicony - Camera Module - VGA, CMOS, 1/6' Format, Fixed Lens - Rollup of basic module plus value add PCB - assumed to be delivered by 3rd party external to EMS

Chicony - 468509-001 - Keyboard Assembly - Injection Molded Plastic Keys, Painted, Silkscreened, on Silicone Rubber Substrate, w/ Stamped / Formed Metal Mounting Bracket, & Interconnect Flex PCB

Samsung Semiconductor - K9GAG08U0M-PCB0 - Flash - NAND, 16Gb, MLC, 2.7-3.6V

Samsung Semiconductor - K9GAG08U0M-PCB0 - Flash - NAND, 16Gb, MLC, 2.7-3.6V

Broadcom - BCM5788MKFBG - Ethernet Controller - 10/100/1000BASE-T, 32-Bit, w/ PHY

HP 2133 Mini-Note PC Notebook Computer - Enclosure DisassemblyHP 2133 Mini-Note PC Notebook Computer - Enclosure Disassembly

Materials and Manufacturing $266.37
What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

OEM/ODM/EMS Relationships / Manufacturing

According to iSuppli's ""Global OEM Design and Manufacturing Analysis", HP's manufacturing capability is nearly all outsourced. iSuppli estimates that HP uses five primary ODMs; Quanta, Compal, Wistron, Inventec and Arima. It is our understanding that Inventec is the ODM for the 2133 Mini-Note PC.

Country of Origin / Volume Assumptions

Based on markings, the unit was assembled in China. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in China.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as LCD display), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. ""Auto" inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Design for Manufacturing / Device Complexity

Invariably, laptop computers represent some of the more complex and electronically dense devices. However, the new emerging 'netbook' category pushes the bounds of cost-effective engineering in terms of reduced overall BOM and manufacturing costs. In order to maintain the durability and usability of laptops, HP has not reduced the overall quality of the material nor manufacturing tolerance as with other low cost PC (ULPC) manufacturers like Asus and FIC. However, in order to squeeze the overall BOM cost to hit the target $500 retail price, HP did resort to using 2nd and 3rd tier parts such as the VIA processors and undersized flash-based SSD.

With that said, the overall component count on the HP 2133 Mini-Note came out to 2113 (excluding box contents), of which, 315 are mechanical in nature. In comparison to other ultra portable laptops we've encountered, the HP 2133 leads in terms of shear component count. This relationship correlates to the overall cost premium of this $500 ultra portable laptop.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Design Notes

The HP 2133 is, in essence, an miniturized HP laptop featuring lower tier component and specifications. In order to meet the low BOM cost ceiling dictated by the 'netbook' market category, HP leveraged the aged VIA C7-M processor and supporting VIA chipsets. Further, the available RAM was limited to a single SODIMM slot. Overall, the HP's approach to the 2133 design is not very exceptional in terms of electrical components. However, surprisingly, HP included a wide array of I/O and interface such as the inclusion of an ExpressCard/54 slot, media card reader and an integrated webcam. Unlike other low cost PCs, the HP 2133 ultilizes more substantial plastics and metals to create a tighter and more durable feel improving overall build quality. The sparcely populated SSD PCB with SATA interface also suggest future upgradeablity in the Mini-Note PC platform.

Here is a summary of the major components used in the HP 2133 Mini-Note PC design:



  • VIA Technologies C7-M 772 UL


  • Graphics & Memory Controller - VIA Technologies - CN896


  • I/O Controller Hub VIA Technologies - VT8237S

I/O & Interface

  • Ethernet Controller - Broadcom - BCM5788MKFBG
  • Embedded Controller - iTE - IT8512E
  • USB Card Reader Controller - Alcor Micro, Corp.- AU6371-JEL


  • Clock Generator - IDT - ICS9LPR730AGLF

Memory Module

  • SODIMM DDR2 - ProMOS Technologies - V916764B24QCFW-F5 (2x2GB)


  • Compact Flash Card Controller w/ Multi-word DMA Support - Silicon Motion - SM223T
  • Flash - Samsung Semiconductor - K9GAG08U0M-PCB0


  • Display Module - Chi Mei Optoelectronics - N089A1-L01


HP 2133 Mini-Note PC Notebook Computer - Box ContentsHP 2133 Mini-Note PC Notebook Computer - Box Contents

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