Power Semiconductors

CES 2026: SDV collaboration emerges between Infineon, HL Klemove

08 January 2026

Aiming to combine semiconductor system design with advanced autonomous driving systems, Infineon Technologies AG and HL Klemove have signed a memorandum of understanding (MOU) to collaborate on automotive platforms for software-defined vehicles (SDVs).

Under the MOU, the companies will focus on three key areas:

  • Next generation zonal control units
  • Vehicle Ethernet-based ADAS and cameras
  • Next generation radar technologies

Zone control units

Under the MOU, HL Klemove will lead application development on zonal control units for SDVs with Infineon supplying microcontrollers and power semiconductors.

The aim is to strengthen competitiveness in SDV electronic architecture by using prototype development.

ADAS and cameras

The companies will develop front camera modules and high-performance compute modules using Infineon’s Ethernet technology.

HL Klemove will handle systema and product development using the Ethernet semiconductors and networking technology for in-vehicle network solutions.

Radar technologies

Using Infineon’s monolithic microwave and millimeter wave ICs, HL Klemove will develop high-resolution and short-range satellite radar and prepare a proof-of-concept to prepare for commercialization.

Additionally, the companies will develop high-resolution imaging radar for object recognition.

Optimizing resources

Both companies point to the ability to optimize resources and accelerate proof of concept as one of the main building blocks to the collaboration. This will allow the companies to bring these technologies to market faster.

The companies also plan to build on this foundation for future projects in the autonomous driving segment that combines Infineon’s semiconductors with HL Klemove’s system integration capabilities.

To contact the author of this article, email PBrown@globalspec.com


Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the GlobalSpec
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement