The Google Pixel 9 Pro Fold folded out to its largest screen. Source: TechInsights
Editor’s note: Information from this teardown is supplied courtesy of TechInsights. Click here to request full access. To view a complimentary report of the Samsung Galaxy S23 FE SM-711B/DS smartphone, click here.
Google is now up to nine generations of its Pixel smartphone. Even more interesting is that this is the fold version.
While folding smartphones are still a niche among consumers, for those who enjoy fold phones they are dedicated to the technology and continue to support it despite the innovations made in other smartphones.
Fold phones offer a larger display while remaining a small form factor by “folding” into a small phone. However, it allows consumers to watch streaming content or other internet media with a larger screen.
In the Google Pixel 9 Pro Fold, the smartphone includes four cameras ranging from 48 megapixels to 10 megapixels. It also features its own proprietary Google Tensor G4 applications processor and 16 GB mobile LPDDR5 SDRAM memory from Micron.
The following is a partial deep dive into the Google Pixel 9 Pro Fold smartphone conducted by TechInsights.
Summary
- 10 MP CMOS BSI cover camera
- 48 MP CMOS BSI wide-angle camera
- 10.8 MP CMOS BSI telephoto camera
- 10.5 MP CMSO BSI ultra-wide-angle camera
Released: September 2024
Price: $1,799
Target market: Telecom
Availability: Worldwide
The main board inside the Google Pixel 9 Pro Fold. Source: TechInsights
Main board
Inside the main board of the Google Pixel 9 Pro Fold resides the main processor, Google’s Tensor G4 processor and main memory from Micron. Other electronic components include:
- Torex Semiconductor’s LDO regulator
- Semtech’s capacitive proximity controller
- Qorvo’s RF antenna tuner
- TDK-InvenSense’s six-axis MEMS gyroscope and accelerometer
- AMS’ ambient light and proximity sensor
- Skyworks’ LB front-end module and UHB LTE/5G NR module
- Texas Instruments’ Hall effect sensor and single 2-input positive-NOR gate
- Cirrus Logic’s class-D audio amplifier and haptic driver
- Google’s Titan M2 security processor
- Analog Devices’ power management IC
- Samsung’s 5G NR baseband processor with memory
- Nexperia’s single d-type flip-flop
(Learn more about analog ICs on Globalspec.com)
The sensor board inside the Google Pixel 9 Pro Fold. Source: TechInsights
Sensor board
The electronic components found on the sensor board of the Google Pixel 9 Pro Fold include an ambient light sensor and proximity/gesture detection sensor from ST Microelectronics as well as a MEMS microphone from Goertek.
(Learn more about sensors on Globalspec.com)
The SIM board inside the Google Pixel 9 Pro Fold. Source: TechInsights
SIM board
Inside the SIM board of the Google Pixel 9 Pro Fold contains the following electronic components:
- Novatech’s display power management
- Texas Instruments’ step-down converter
- Qorvo’s RF antenna tuner
(Learn more about RF antenna’s on Globalspec.com)
Some of the components found inside the Google Pixel 9 Pro Fold. Source: TechInsights
Major components
- $132.47 — 120 Hz main display/touchscreen subsystem — BOE (QTY: 1)
- $112.42 — Octa-Core Google Tensor G4 applications processor — Google (QTY: 1)
- $42.70 — Multichip memory — 16 GB Mobile LPDDR5 SDRAM — Micron (QTY: 1)
- $33.40 — 48 MP wide-angle camera subsystem (QTY: 1)
- $30.51 — 5G NR baseband processor w/ memory — Samsung (QTY: 1)
- $25.64 — 10.8 MP periscope telephoto camera subsystem — SEMCO (QTY: 1)
- $25.59 — 120 Hz secondary display/touchscreen subsystem — BOE (QTY: 1)
- $21.58 — 5G mmWave subsystem — Murata (QTY: 1)
- $20.23 — Multichip memory — 256 GB 3D TLC NAND flash, memory controller — KIOXIA (QTY: 1)
- $17.76 — 10.5 MP ultra-wide-angle camera subsystem — SEMCO (QTY: 1)
