The Google Pixel 8 is the flagship smartphone of the company and includes the company’s Tensor G3 main applications processor. Source: TechInsightsEditor’s note: Information from this teardown is supplied courtesy of TechInsights. Learn more about the Google Pixel 8 teardown here.
The Google 8A just recently debuted with numerous new features compared to the flagship device that was launched late last year.
While a teardown of the device will likely come, in the meantime, TechInsights did a deep dive into the Google Pixel 8 smartphone.
The Google Pixel 8 is powered by the company’s proprietary nona-core Tensor G3 applications processor and four rear and front facing cameras including a whopping 50 mega-pixel BSI CMOS wide-angle camera.
Other features include the 120 Hz touchscreen display and 8 GB of mobile LPDDR5 SDRAM from Micron Technology.
The following is a partial deep dive into the Google Pixel 8 conducted by TechInsights.
Summary
- 6.18-inch AMOLED touchscreen display
- 8 GB LPDDR5 SDRAM
- 10 MP BSI CMOS ultra-wide-angle camera
- 50 MP BSI CMOS wide-angle camera
- 12 MP BSI CMOS ultra-wide-angle camera
Price: $690
Released: October 2023
Availability: Worldwide
Target market: Mobile
Main board
The main board of the Google Pixel 8 includes the Tensor G3 applications processor as well as Samsung and Micron’s multichip memory modules. Other electronic components include:
- Google’s Titan M2 security processor
- Texas Instruments’ single two-input positive NOR gate and USB 2.0 repeater
- NXP Semiconductors’ 8 A switched capacitor charger
- Analog Devices’ power management IC
- Nexperia’s single two-input NOR gate and D-type flip-flop
- TDK Invensense’s digital barometric pressure/temperature sensor and six-axis MEMS Gyroscope/accelerometer
- Murata’s SAW filters
- AMS’ ambient light and proximity sensor
- Qorvo’s RF antenna tuner
- Skyworks’ quad-based GSM power amplifier and step-down DC-DC converter
- Samsung’s 5G NR baseband processor
- Cirrus Logic’s haptic driver
- Knowles’ MEMS microphone
(Learn more about RF ICs on Globalspec.com)
The microphone flex board has the Knowles MEMS microphone inside. Source: TechInsights
Microphone flex board
The microphone board has the main component of the Knowles’ MEMS microphone for the user to access the voice functions inside the Google Pixel 8 smartphone.
(Learn more about MEMS devices on Globalspec.com)
Sensor board
Found inside the Google Pixel 8’s sensor board are the components used to help with a variety of sensing capabilities. These components include:
- ST Microelectronics’ time-of-flight proximity/gesture detection sensor
- ST Microelectronics’ ambient light sensor
- Knowles’ MEMS microphone
(Learn more about sensors on Globalspec.com)
Some of the components found inside the Google Pixel 8 smartphone. Source: TechInsights
Major components
$105.62 — Nona-core Google Tensor G3 applications processor (Qty: 1)
$60.10 — 50 MP wide-angle rear camera subsystem (Qty: 1)
$31.42 — 120 Hz touchscreen display — BOE (Qty: 1)
$23.73 — 5G NR baseband processor w/ memory — Samsung (Qty: 1)
$19.81 — 12 MP ultra-wide-angle rear camera subsystem (Qty: 1)
$19.22 — Main frame (Qty: 1)
$13.28 — Wi-Fi 7/Bluetooth 5.3 module (Qty: 1)
$13.26 — 10 MP ultra-wide-angel front camera subsystem (Qty: 1)
$11.84 — RF transceiver + GPS — Samsung (Qty: 1)
$11.62 — 8 GB mobile LPDDR5 SDRAM — Micron Technology (Qty: 1)
