Semiconductor Equipment

GF to build advanced packaging factory in New York

22 January 2025

Pure play semiconductor foundry GlobalFoundries (GF) said it will create a new center for advanced packaging and testing of U.S.-made essential chips at its New York manufacturing facility.

Called the New York Advanced Packaging and Photonics Center, the factory will be used to allow semiconductors to be securely manufactured, processed, packaged and tested entirely onshore in the U.S. The center will also be used for silicon photonics and other essential chips needed for markets like AI, automotive, aerospace and defense and communications.

Advanced packaging, assembly and testing of silicon photonics, which brings optical and electrical components on a single chip, will allow these semiconductors to be used in applications like:

  • Automotive
  • Communications
  • Radar
  • Critical infrastructure

What it will do

The packaging and testing center will provide packaging, bump, assembly and testing for users under GF’s Trusted Foundry accreditation so they can be used in national security systems. This also applies to the advanced packaging, wafer-to-wafer bonding, assembly and testing of 3D and heterogeneously integrated (HI) chips using GF’s 12LP+, 22FDX and other leading process technologies.

The advanced packaging capabilities will be used to transform chips into individual packages ready for end-product use. Most of these capabilities are not onshore in America but in Asia.

GF’s overall investment in the center is expected to be $575 million with an additional $186 million investment in research and development over the next 10 years. It will lead to about 100 full-time GF jobs in New York over the next five years.

Through the CHIPS and Science Act, the U.S. Department of Commerce will provide up to $75 million in direct funding while New York state will provide an additional $20 million in support for the new center.

To contact the author of this article, email PBrown@globalspec.com


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